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IR2010STRPBF

Infineon Technologies

IR2010STRPBF by Infineon Technologies

Infineon Technologies' IR2010STRPBF is a MOSFET gate driver with 16 terminals, suitable for automotive applications. It operates b/w -40 to 125°C and has a supply voltage range of 10-20V. With a turn-on time of 0.135 us and output peak current limit of 3A, it offers efficient high side driver functionality.

Median Price

$1.844

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Chip1Stop

Japan . 998 parts In-Stock

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$1.780

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$1.780

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Mouser Electronics

USA . 1,079 parts In-Stock

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$3.870

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$2.360

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$2.070

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$2.010

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$3.870

$2.360

$2.070

$2.010

Arrow

USA . 2,000 parts In-Stock

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$1.837

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$1.738

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$1.738

Verical

USA . 2,000 parts In-Stock

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$1.844

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$1.745

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$1.745

Element14

Singapore . 400 parts In-Stock

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$2.050

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$1.910

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400

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DigiKey

USA . 314 parts In-Stock

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$2.435

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$2.349

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Farnell

UK . 242 parts In-Stock

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$1.770

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$1.460

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Digiode

USA . 786 parts In-Stock

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$1.568

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TME

Poland . 914 parts In-Stock

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$3.190

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$2.170

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Chip Stock

USA . 11,050 parts In-Stock

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Vyrian

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Bristol Electronics

USA . 1,000 parts In-Stock

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Classic Components Corporation

USA . 943 parts In-Stock

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QIE Inc.

USA . 210 parts In-Stock

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Maverick Electronics, Inc.

USA . 98 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,133 parts In-Stock

1+ parts

$1.310

100+ parts

$1.277

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$1.271

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$1.310

$1.277

$1.271

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Ampacity Inc.

Singapore . 2,264 parts In-Stock

1+ parts

$1.390

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$1.390

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Corphita

USA . 860 parts In-Stock

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$1.485

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$1.485

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CoreStaff

Japan . 1,000 parts In-Stock

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$6.272

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$2.379

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$6.272

$2.379

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Corohmni

South Africa . 404 parts In-Stock

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$8.228

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$8.228

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Aztec Data Supply Inc.

USA . 3,851 parts In-Stock

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$9.898

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Modulus Dynamics

Lithuania . 3,522 parts In-Stock

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$12.371

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$11.876

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$11.381

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Infinite Electronics LLP (Excess)

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Lixinc

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Kepictronics

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Perfect Parts

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RC Electronics

USA . 6,160 parts In-Stock

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$3.290

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$3.190

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Argo Parts USA

USA . 3,898 parts In-Stock

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Continental Prestige Electronics

USA . 3,640 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 2,462 parts In-Stock

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,641 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Upgrade your devices with the cutting-edge IR2010STRPBF MOSFET Gate Driver from Infineon Technologies. Experience superior quality and reliability with a manufacturer you can trust. This small outline package offers high side driver capability, allowing for seamless integration into a wide range of automotive applications. With a quick turn-on time and peak output current limit of 3A, this driver ensures optimal performance and efficiency. Trust Infineon Technologies to elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Ease of installation and space-saving design in electronic circuits.

Maximum Supply Voltage: 20 V

Allows for operation in a wide range of voltage environments.

Package Shape: RECTANGULAR

Helps in easy integration and placement on circuit boards.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in the system.

Minimum Supply Voltage: 10 V

Ensures proper functioning even in low voltage conditions.

Maximum Operating Temperature: 125 °C

High operating temperature range suitable for various industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures making it suitable for diverse operating environments.

Terminal Finish: TIN

Provides good electrical conductivity and corrosion resistance.

Width: 7.5 mm

Compact size allows for efficient use of space on the circuit board.

High Side Driver: YES

Enables driving of high side MOSFETs for effective power management.

Nominal Supply Voltage: 15 V

Ideal voltage for stable and efficient operation of the driver.

Turn-on Time: 0.135 us

Fast turn-on time for quick and responsive driving of MOSFETs.

Nominal Output Peak Current Limit: 3 A

Capable of handling high peak currents for demanding applications.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Specifically designed for driving half-bridge MOSFET configurations for optimal performance.

Technical Specifications

MOSFET Gate Drivers IR2010STRPBF attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.105 us

Turn-on Time:

.135 us

Width:

7.5 mm

Trade Compliance

IR2010STRPBF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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