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IPT015N10N5

Infineon Technologies

IPT015N10N5 by Infineon Technologies

IPT015N10N5 by Infineon Technologies is a N-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 1200A IDM, 652mJ EAS, and 0.0015 ohm RDS(ON). Utilizes METAL-OXIDE SEMICONDUCTOR tech in a SMALL OUTLINE package with SILICON element material.

Median Price

$6.871

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,351 parts In-Stock

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$6.871

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$6.323

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1,351

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$6.871

$6.323

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Distributors (In-Stock)

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Maritex

Poland . 7,749 parts In-Stock

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$1.956

100+ parts

$1.359

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$1.117

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7,749

$1.956

$1.359

$1.117

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Cyclops Electronics Ltd

UK . 16,000 parts In-Stock

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Sensible Micro Corp

USA . 4,156 parts In-Stock

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Rutronik

Germany . 2,000 parts In-Stock

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$3.340

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Vyrian

USA . 1,964 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Extreme Components

USA . 636 parts In-Stock

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Digiode

USA . 419 parts In-Stock

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Bristol Electronics

USA . 153 parts In-Stock

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Semtec, LLC

USA . 1 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 148 parts In-Stock

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$0.304

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148

$0.304

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Modulus Dynamics

Lithuania . 13,076 parts In-Stock

1+ parts

$0.454

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$0.436

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$0.418

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13,076

$0.454

$0.436

$0.418

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Semicontronic

India . 1,605 parts In-Stock

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$4.670

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$4.553

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$4.530

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1,605

$4.670

$4.553

$4.530

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Ampacity Inc.

Singapore . 1,506 parts In-Stock

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$4.670

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CoreStaff

Japan . 1,360 parts In-Stock

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$10.380

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$4.561

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Infinite Electronics LLP (Excess)

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Lixinc

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A-Z Elektronik GmbH

Germany . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,957 parts In-Stock

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Argo Parts USA

USA . 4,950 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,300 parts In-Stock

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Corphita

USA . 785 parts In-Stock

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Kepictronics

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Bastille Electronics

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Overview

Unleash the power of innovation with the IPT015N10N5 by Infineon Technologies. Crafted with precision and expertise, this N-channel Power Field Effect Transistor offers unparalleled performance for switching applications. With a high DS breakdown voltage of 100V and maximum drain current of 32A, this transistor delivers reliable and efficient operation. Whether you're in the automotive, industrial, or consumer electronics industry, this product's single configuration with built-in diode provides the perfect solution for your power management needs. Elevate your projects with the quality and value that only Infineon Technologies can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower conduction losses and higher efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from voltage spikes and reverse currents, improving overall circuit protection.

Transistor Application: SWITCHING

Designed specifically for fast switching applications, making it ideal for power management and control in various electronic devices.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltage applications with a safety margin, ensuring reliable performance under varying voltage conditions.

Package Shape: RECTANGULAR

Easily fits into standard PCB layouts, making it compatible with existing designs and allowing for efficient integration.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, providing better control over the switching operation and minimizing power consumption.

Maximum Pulsed Drain Current (IDM): 1200 A

Capable of handling high current spikes without damage, making it suitable for demanding applications that require robust performance.

Avalanche Energy Rating (EAS): 652 mJ

Withstands energy spikes during avalanche breakdown, offering enhanced reliability in surge-prone environments.

No. of Terminals: 8

Provides multiple connection points for versatile circuit configurations, allowing for customization and flexibility.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the PCB and enables higher component density, optimizing overall system performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and low power consumption, making it an energy-efficient choice for various electronic applications.

Transistor Element Material: SILICON

Silicon-based FETs provide excellent performance characteristics, such as low on-state resistance and high switching speed.

Terminal Finish: TIN

Tin finish ensures good conductivity and solderability, facilitating easy and reliable connections in the assembly process.

Maximum Drain Current (ID): 32 A

Sufficient current-carrying capacity for medium to high-power applications, meeting the demands of diverse electronic systems.

Maximum Drain-Source On Resistance: 0.0015 ohm

Low on-resistance minimizes power losses and improves efficiency, making it suitable for high-performance power management applications.

Terminal Position: SINGLE

Simplified connection layout for easy integration into circuit designs, enhancing overall system efficiency and reliability.

Case Connection: DRAIN

Drain-connected FETs offer better thermal performance and easier heat dissipation, ensuring reliable operation under high power conditions.

Technical Specifications

Power Field Effect Transistors (FET) IPT015N10N5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

652 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.0015 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

1200 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPT015N10N5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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