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IPP80N08S2L07XK

Infineon Technologies

IPP80N08S2L07XK by Infineon Technologies

IPP80N08S2L07XK by Infineon is a N-CHANNEL FET with 75V DS Breakdown Voltage, 0.0071 ohm Drain-Source On Resistance, and 320A Pulsed Drain Current. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and 810mJ Avalanche Energy Rating.

Median Price

$3.264

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$3.264

100+ parts

-

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1,000

$3.264

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Vyrian

USA . 769 parts In-Stock

1+ parts

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769

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Digiode

USA . 707 parts In-Stock

1+ parts

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707

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 35,419 parts In-Stock

1+ parts

$1.530

100+ parts

-

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35,419

$1.530

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Continental Prestige Electronics

USA . 5,225 parts In-Stock

1+ parts

$3.264

100+ parts

-

1k+ parts

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10k+ parts

$3.198

5,225

$3.264

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$3.198

Argo Parts USA

USA . 2,808 parts In-Stock

1+ parts

$3.264

100+ parts

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2,808

$3.264

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Modulus Dynamics

Lithuania . 5,636 parts In-Stock

1+ parts

$3.264

100+ parts

$3.133

1k+ parts

$3.003

10k+ parts

-

5,636

$3.264

$3.133

$3.003

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Corohmni

South Africa . 1,115 parts In-Stock

1+ parts

$3.264

100+ parts

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1,115

$3.264

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$3.786

100+ parts

$3.483

1k+ parts

$3.264

10k+ parts

-

350

$3.786

$3.483

$3.264

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AZTECH Wire

Italy . 700 parts In-Stock

1+ parts

$16.091

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700

$16.091

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Semicontronic

India . 1,509 parts In-Stock

1+ parts

$19.050

100+ parts

$18.574

1k+ parts

$18.478

10k+ parts

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1,509

$19.050

$18.574

$18.478

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Ampacity Inc.

Singapore . 1,384 parts In-Stock

1+ parts

$47.050

100+ parts

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1,384

$47.050

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Corphita

USA . 163 parts In-Stock

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163

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Overview

Discover the unparalleled performance of the IPP80N08S2L07XK by Infineon Technologies, a top-of-the-line Power FET that delivers exceptional quality and reliability. This cutting-edge product is perfect for a wide range of switching applications, providing customers with unmatched value and efficiency. With a high DS breakdown voltage, single configuration with built-in diode, and low drain-source on resistance, this FET offers superior performance and durability. Trust Infineon Technologies to deliver innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and high thermal conductivity, making the product durable and efficient.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower resistance compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in minimizing reverse current flow and protects the circuit from damage, enhancing the overall reliability of the product.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and efficient performance, making it suitable for a wide range of electronic circuits.

Minimum DS Breakdown Voltage: 75 V

With a high breakdown voltage, this FET can handle high voltages without breakdown, ensuring reliable operation in demanding conditions.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and easy soldering, making it convenient for through-hole PCB assembly.

Maximum Pulsed Drain Current (IDM): 320 A

High pulsed drain current rating allows the FET to handle transient high current spikes without damage, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 810 mJ

High avalanche energy rating indicates the FET's ability to withstand energy spikes, ensuring robust performance in high-energy applications.

No. of Terminals: 3

Having three terminals allows for flexible circuit configurations and easy integration into various electronic systems.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers easy mounting and heat dissipation, improving the overall thermal performance of the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good control over the FET's operation, resulting in low power consumption and high efficiency.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate reliably in high-temperature environments without degradation in performance.

Transistor Element Material: SILICON

Silicon material offers good thermal and electrical properties, ensuring stable and efficient operation of the transistor.

Maximum Drain Current (ID): 80 A

High drain current rating allows the FET to handle high continuous currents, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.0071 ohm

Low drain-source on resistance results in minimal power loss and better efficiency, making the FET an ideal choice for high-power applications.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and reduces the chances of errors during assembly, enhancing the overall reliability of the product.

Technical Specifications

Power Field Effect Transistors (FET) IPP80N08S2L07XK attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

Avalanche Energy Rating (EAS):

810 mJ

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0071 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP80N08S2L07XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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