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IPP180N10N3G

Infineon Technologies

IPP180N10N3G by Infineon Technologies

IPP180N10N3G by Infineon Technologies is a N-CHANNEL FET with 100V DS breakdown voltage. It has a max IDM of 172A and EAS of 50mJ, suitable for switching applications. With 0.018 ohm RDS(on) and 175°C max operating temp, it's ideal for high-power tasks in various industries.

Median Price

$1.271

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 750 parts In-Stock

1+ parts

$1.920

100+ parts

$0.811

1k+ parts

$0.581

10k+ parts

$0.529

750

$1.920

$0.811

$0.581

$0.529

RS (Exports)

UK . 600 parts In-Stock

1+ parts

-

100+ parts

$0.622

1k+ parts

$0.571

10k+ parts

-

600

-

$0.622

$0.571

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 658 parts In-Stock

1+ parts

$0.622

100+ parts

-

1k+ parts

-

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658

$0.622

-

-

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Digiode

USA . 401 parts In-Stock

1+ parts

$1.254

100+ parts

-

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401

$1.254

-

-

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

1+ parts

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3

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 7,898 parts In-Stock

1+ parts

$1.145

100+ parts

$1.099

1k+ parts

$1.053

10k+ parts

-

7,898

$1.145

$1.099

$1.053

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Corphita

USA . 742 parts In-Stock

1+ parts

$1.188

100+ parts

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742

$1.188

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Lixinc

USA . 19,519 parts In-Stock

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19,519

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Infinite Electronics LLP (Excess)

. 15,007 parts In-Stock

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15,007

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Perfect Parts

USA . 14,860 parts In-Stock

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14,860

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Kepictronics

USA . 10,065 parts In-Stock

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10,065

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A-Z Elektronik GmbH

Germany . 9,780 parts In-Stock

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100+ parts

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9,780

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Alle Elektronik GmbH

Germany . 3,020 parts In-Stock

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100+ parts

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3,020

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Overview

Unlock the power of innovation with the IPP180N10N3G by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) offers reliable performance in switching applications. With a high DS breakdown voltage of 100V and maximum drain current of 43A, this transistor delivers unparalleled efficiency and durability. Whether you're designing industrial machinery or automotive electronics, trust the IPP180N10N3G to enhance your projects with its exceptional quality and performance. Elevate your creations with the Infineon advantage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

Offers better conductivity and efficiency compared to P-channel transistors, making it suitable for high power applications.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltage operations, making it suitable for use in power electronics applications.

Maximum Pulsed Drain Current (IDM): 172 A

Capable of handling high current spikes, ideal for applications where intermittent high power is required.

Maximum Power Dissipation (Abs): 71 W

Can dissipate heat effectively, allowing for continuous operation without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and fast switching speeds, making it ideal for switching applications.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without degradation, suitable for industrial applications.

Maximum Drain-Source On Resistance: 0.018 ohm

Low on-resistance leads to minimal power loss and heat generation, increasing efficiency.

Technical Specifications

Power Field Effect Transistors (FET) IPP180N10N3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

50 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

43 A

Maximum Drain Current (ID):

43 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

172 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

10

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP180N10N3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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