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IPI041N12N3GAKSA1

Infineon Technologies

IPI041N12N3GAKSA1 by Infineon Technologies

Infineon Technologies' IPI041N12N3GAKSA1 is a power FET with N-channel polarity. It has a min DS breakdown voltage of 120V and can handle a max pulsed drain current of 480A. This transistor is commonly used for switching applications.

Median Price

$3.053

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Chip1Stop

Japan . 3,930 parts In-Stock

1+ parts

$3.053

100+ parts

$2.239

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-

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3,930

$3.053

$2.239

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-

Arrow

USA . 3,430 parts In-Stock

1+ parts

$5.308

100+ parts

$3.753

1k+ parts

$2.997

10k+ parts

$2.839

3,430

$5.308

$3.753

$2.997

$2.839

DigiKey

USA . 500 parts In-Stock

1+ parts

$5.820

100+ parts

$2.801

1k+ parts

$2.335

10k+ parts

-

500

$5.820

$2.801

$2.335

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Verical

USA . 37,000 parts In-Stock

1+ parts

-

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$2.817

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37,000

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-

$2.817

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Rochester

USA . 775 parts In-Stock

1+ parts

-

100+ parts

$2.250

1k+ parts

$2.010

10k+ parts

$1.900

775

-

$2.250

$2.010

$1.900

Distributors (In-Stock)

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Digiode

USA . 645 parts In-Stock

1+ parts

$2.375

100+ parts

-

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645

$2.375

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Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$3.693

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41

$3.693

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Vyrian

USA . 4,171 parts In-Stock

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4,171

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,811 parts In-Stock

1+ parts

$0.740

100+ parts

-

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-

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1,811

$0.740

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-

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Semicontronic

India . 2,563 parts In-Stock

1+ parts

$2.130

100+ parts

$2.077

1k+ parts

$2.066

10k+ parts

-

2,563

$2.130

$2.077

$2.066

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Ampacity Inc.

Singapore . 2,383 parts In-Stock

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$2.130

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2,383

$2.130

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Corphita

USA . 376 parts In-Stock

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$2.250

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376

$2.250

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Argo Parts USA

USA . 4,790 parts In-Stock

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$3.693

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4,790

$3.693

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Continental Prestige Electronics

USA . 2,431 parts In-Stock

1+ parts

$3.693

100+ parts

-

1k+ parts

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10k+ parts

$3.619

2,431

$3.693

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-

$3.619

Modulus Dynamics

Lithuania . 24,710 parts In-Stock

1+ parts

$4.130

100+ parts

$3.965

1k+ parts

$3.800

10k+ parts

-

24,710

$4.130

$3.965

$3.800

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Corohmni

South Africa . 219 parts In-Stock

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$4.130

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219

$4.130

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AZTECH Wire

Italy . 756 parts In-Stock

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$13.330

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756

$13.330

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Microchip USA

USA . 8,078 parts In-Stock

1+ parts

$17.780

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8,078

$17.780

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Perfect Parts

USA . 2,695 parts In-Stock

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2,695

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$3.619

1k+ parts

$3.509

10k+ parts

$3.435

500

-

$3.619

$3.509

$3.435

Overview

Experience superior performance and reliability with the IPI041N12N3GAKSA1 by Infineon Technologies. As a leader in power field effect transistors, Infineon Technologies brings you a high-quality product that excels in switching applications. With its single-channel configuration and built-in diode, this transistor offers unparalleled convenience and efficiency. Its impressive 120V minimum DS breakdown voltage ensures robustness, while the maximum pulsed drain current of 480A guarantees exceptional power handling capabilities. Whether you're powering industrial equipment or designing cutting-edge technology, trust the IPI041N12N3GAKSA1 to deliver the performance you need.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and resistance against harsh environmental conditions, making it a reliable choice for various applications.

Polarity or Channel Type:

N-CHANNEL - This feature allows for efficient current flow in one direction, making it suitable for applications requiring low power consumption.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and protects against reverse voltage, making it convenient for applications where space is limited.

Transistor Application:

SWITCHING - This feature enables fast switching speeds, making it ideal for applications that require rapid and precise control.

Minimum DS Breakdown Voltage:

120 V - With a high breakdown voltage, this product can handle high voltage applications while maintaining stable performance, ensuring safety and reliability.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy mounting and installation, making it convenient for various circuit designs.

Terminal Form:

THROUGH-HOLE - The through-hole form makes it compatible with conventional soldering techniques, making it suitable for DIY projects and prototyping.

Operating Mode:

ENHANCEMENT MODE - The enhancement mode operation provides better control over the current flow, allowing for more efficient power management.

No. of Elements:

1 - Having a single element simplifies circuit design and reduces complexity, making it easier to integrate into different systems.

Maximum Pulsed Drain Current (IDM):

480 A - This high current rating allows the transistor to handle heavy loads and sudden surges, ensuring reliable performance in demanding applications.

Avalanche Energy Rating (EAS):

900 mJ - The high energy rating ensures robustness against voltage spikes and transient events, enhancing the overall reliability of the product.

No. of Terminals:

3 - The three-pin configuration allows for easy connection and integration into various circuit layouts, offering flexibility and versatility.

Package Style (Meter):

IN-LINE - The in-line package style allows for compact and space-efficient mounting, making it suitable for applications with limited physical space.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - The MOSFET technology provides high power efficiency, low gate drive requirements, and fast switching speeds, making it an efficient choice for power applications.

Maximum Operating Temperature:

175 °C - This high operating temperature range allows the transistor to withstand harsh environments and maintain stable operation, ensuring reliability under challenging conditions.

Transistor Element Material:

SILICON - The silicon material offers excellent electrical properties, high performance, and thermal stability, making it a preferred choice for power applications.

Terminal Finish:

TIN - The tin finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections and long-lasting performance.

Maximum Drain Current (ID):

120 A - This high current rating allows for efficient power handling, making it suitable for applications that require high power output.

Maximum Drain-Source On Resistance:

0.0041 ohm - The low on-resistance minimizes power losses and improves efficiency, making it ideal for applications that demand high power transfer and low heat dissipation.

Terminal Position:

SINGLE - The single terminal position simplifies installation and connection, ensuring ease of use and compatibility with various circuit layouts.

Technical Specifications

Power Field Effect Transistors (FET) IPI041N12N3GAKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

900 mJ

Minimum DS Breakdown Voltage:

120 V

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0041 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPI041N12N3GAKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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