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IPA80R460CE

Infineon Technologies

IPA80R460CE by Infineon Technologies

Infineon's IPA80R460CE is a N-CHANNEL FET with 800V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 33A IDM, 470mJ EAS, and 0.46 ohm RDS(on). Package: PLASTIC/EPOXY RECTANGULAR with THROUGH-HOLE terminals. Suitable for ENHANCEMENT MODE operation in various power electronics systems.

Median Price

$1.400

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Rutronik

Germany . 10,000 parts In-Stock

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$1.400

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$1.090

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Vyrian

USA . 585 parts In-Stock

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Digiode

USA . 579 parts In-Stock

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Nova Conductors

Japan . 83 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 294 parts In-Stock

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$1.060

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294

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Modulus Dynamics

Lithuania . 1,967 parts In-Stock

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$1.761

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$1.691

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$1.620

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AZTECH Wire

Italy . 647 parts In-Stock

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$19.492

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Ampacity Inc.

Singapore . 361 parts In-Stock

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$54.050

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,800 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Kepictronics

USA . 5,700 parts In-Stock

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Continental Prestige Electronics

USA . 5,590 parts In-Stock

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Argo Parts USA

USA . 3,356 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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Corphita

USA . 721 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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Overview

Unleash the power of innovation with the IPA80R460CE by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors that redefine performance standards. From switching applications to enhancement mode operation, this N-CHANNEL transistor offers unparalleled reliability and efficiency. With a high DS Breakdown Voltage of 800V and a Maximum Drain Current of 10.8A, the IPA80R460CE is designed to meet the demands of today's technology-driven world. Experience the superior benefits of Infineon's cutting-edge semiconductor technology and elevate your projects to new heights with the IPA80R460CE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and conductivity, making them suitable for high-performance switching applications.

Transistor Application: SWITCHING

Designed for switching applications, ensuring efficient and reliable operation in various electronic circuits.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET can handle high voltage applications without the risk of breakdown.

Maximum Pulsed Drain Current (IDM): 33 A

High pulsed drain current rating allows the FET to handle sudden current spikes without compromising performance.

Avalanche Energy Rating (EAS): 470 mJ

The high avalanche energy rating indicates the FET can withstand energy spikes and transient events without damage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in a compact design.

Maximum Drain-Source On Resistance: 0.46 ohm

Low on-resistance minimizes power losses and heat generation, improving efficiency in various circuit applications.

Technical Specifications

Power Field Effect Transistors (FET) IPA80R460CE attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

470 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

10.8 A

Maximum Drain-Source On Resistance:

.46 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

33 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA80R460CE Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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