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IPA028N08N3GXKSA1

Infineon Technologies

IPA028N08N3GXKSA1 by Infineon Technologies

Infineon's IPA028N08N3GXKSA1 is a N-CHANNEL FET with 80V DS breakdown voltage, ideal for switching applications. Featuring a max IDM of 352A and 0.0028 ohm RDS(on), it operates in enhancement mode. The transistor, made of silicon MOSFET technology, comes in a rectangular package with through-hole terminals.

Median Price

$4.425

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

$1.460

100+ parts

-

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-

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2

$1.460

-

-

-

Mouser Electronics

USA . 77 parts In-Stock

1+ parts

$6.840

100+ parts

$5.070

1k+ parts

$3.880

10k+ parts

$3.560

77

$6.840

$5.070

$3.880

$3.560

Distrelec

Netherlands . 50 parts In-Stock

1+ parts

$9.473

100+ parts

$6.761

1k+ parts

-

10k+ parts

-

50

$9.473

$6.761

-

-

Rochester

USA . 19,569 parts In-Stock

1+ parts

-

100+ parts

$3.540

1k+ parts

$3.170

10k+ parts

$2.980

19,569

-

$3.540

$3.170

$2.980

Verical

USA . 7,432 parts In-Stock

1+ parts

-

100+ parts

$4.425

1k+ parts

$3.962

10k+ parts

$3.725

7,432

-

$4.425

$3.962

$3.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 479 parts In-Stock

1+ parts

$1.387

100+ parts

-

1k+ parts

-

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479

$1.387

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.683

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$3.683

-

-

-

Vyrian

USA . 3,418 parts In-Stock

1+ parts

-

100+ parts

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3,418

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$0.853

100+ parts

$0.776

1k+ parts

$0.699

10k+ parts

-

900

$0.853

$0.776

$0.699

-

Ampacity Inc.

Singapore . 4,926 parts In-Stock

1+ parts

$1.240

100+ parts

-

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-

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4,926

$1.240

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-

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Corphita

USA . 700 parts In-Stock

1+ parts

$1.314

100+ parts

-

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700

$1.314

-

-

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Aztec Data Supply Inc.

USA . 3,882 parts In-Stock

1+ parts

$1.496

100+ parts

-

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3,882

$1.496

-

-

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Corohmni

South Africa . 201 parts In-Stock

1+ parts

$1.526

100+ parts

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201

$1.526

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-

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Modulus Dynamics

Lithuania . 4,971 parts In-Stock

1+ parts

$1.713

100+ parts

$1.644

1k+ parts

$1.576

10k+ parts

-

4,971

$1.713

$1.644

$1.576

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Argo Parts USA

USA . 4,668 parts In-Stock

1+ parts

$3.683

100+ parts

-

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10k+ parts

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4,668

$3.683

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Continental Prestige Electronics

USA . 2,949 parts In-Stock

1+ parts

$3.683

100+ parts

-

1k+ parts

-

10k+ parts

$3.609

2,949

$3.683

-

-

$3.609

Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$36.340

100+ parts

-

1k+ parts

$25.438

10k+ parts

$25.438

50

$36.340

-

$25.438

$25.438

Perfect Parts

USA . 1,804 parts In-Stock

1+ parts

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1,804

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$3.609

1k+ parts

$3.499

10k+ parts

$3.425

50

-

$3.609

$3.499

$3.425

Overview

Unlock the power of cutting-edge technology with the Infineon IPA028N08N3GXKSA1 Power Field Effect Transistor. Crafted by industry leader Infineon Technologies, this N-channel transistor boasts unparalleled quality and reliability. Ideal for switching applications, this transistor offers a breakthrough in performance with a maximum drain current of 89A and minimum DS breakdown voltage of 80V. With its single configuration and built-in diode, it provides seamless operation and enhanced efficiency. Experience the benefits of enhanced mode operation and superior energy efficiency with this high-performing transistor. Elevate your projects to new heights with the Infineon IPA028N08N3GXKSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation, making the FET suitable for a variety of environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling in switching applications, reducing losses.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Minimum DS Breakdown Voltage: 80 V

With a high breakdown voltage, this FET can handle higher voltages, increasing its versatility.

Terminal Form: THROUGH-HOLE

Through-hole terminals make for easy and secure connections on a PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the switching operation, enhancing overall efficiency.

Maximum Pulsed Drain Current (IDM): 352 A

High current handling capability allows for use in high-power applications.

Avalanche Energy Rating (EAS): 1430 mJ

A high avalanche energy rating ensures the FET can withstand sudden high-energy spikes without damage.

No. of Terminals: 3

Simple 3-terminal design for easy integration into circuits.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mechanical mounting in applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, ideal for switching applications.

Transistor Element Material: SILICON

Silicon technology provides reliable and consistent performance.

Terminal Finish: TIN

Tin finish on terminals ensures good conductivity and corrosion resistance.

Maximum Drain Current (ID): 89 A

High drain current rating allows for use in high-power circuits.

Maximum Drain-Source On Resistance: 0.0028 ohm

Low on-resistance leads to minimal power losses and heat generation during operation.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout and connection.

Case Connection: ISOLATED

Isolated case connection adds safety and protection in high-voltage applications.

Technical Specifications

Power Field Effect Transistors (FET) IPA028N08N3GXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

1430 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

89 A

Maximum Drain-Source On Resistance:

.0028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

352 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA028N08N3GXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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