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IPA060N06NXKSA1

Infineon Technologies

IPA060N06NXKSA1 by Infineon Technologies

IPA060N06NXKSA1 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage and 180A IDM. Ideal for SWITCHING applications, it features 0.006 ohm RDS(ON) and 60mJ EAS rating. Package: PLASTIC/EPOXY, Shape: RECTANGULAR, Technology: MOSFET.

Median Price

$2.075

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 267 parts In-Stock

1+ parts

$1.760

100+ parts

$1.030

1k+ parts

$0.698

10k+ parts

$0.677

267

$1.760

$1.030

$0.698

$0.677

DigiKey

USA . 320 parts In-Stock

1+ parts

$2.390

100+ parts

$1.049

1k+ parts

$0.774

10k+ parts

$0.698

320

$2.390

$1.049

$0.774

$0.698

Mouser Electronics

USA . 199 parts In-Stock

1+ parts

$2.390

100+ parts

$1.050

1k+ parts

$0.799

10k+ parts

-

199

$2.390

$1.050

$0.799

-

Chip1Stop

Japan . 208 parts In-Stock

1+ parts

$2.400

100+ parts

$1.120

1k+ parts

$0.862

10k+ parts

$0.803

208

$2.400

$1.120

$0.862

$0.803

Element14

Singapore . 267 parts In-Stock

1+ parts

$2.770

100+ parts

$1.870

1k+ parts

$1.250

10k+ parts

$1.200

267

$2.770

$1.870

$1.250

$1.200

Rochester

USA . 28,423 parts In-Stock

1+ parts

-

100+ parts

$0.949

1k+ parts

$0.787

10k+ parts

$0.702

28,423

-

$0.949

$0.787

$0.702

Verical

USA . 9,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.984

10k+ parts

$0.877

9,500

-

-

$0.984

$0.877

RS (Exports)

UK . 476 parts In-Stock

1+ parts

-

100+ parts

$1.545

1k+ parts

$1.424

10k+ parts

-

476

-

$1.545

$1.424

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 348 parts In-Stock

1+ parts

$0.841

100+ parts

-

1k+ parts

-

10k+ parts

-

348

$0.841

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.965

100+ parts

-

1k+ parts

-

10k+ parts

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100

$0.965

-

-

-

Vyrian

USA . 3,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,166

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,950 parts In-Stock

1+ parts

$0.740

100+ parts

-

1k+ parts

-

10k+ parts

-

2,950

$0.740

-

-

-

Corphita

USA . 609 parts In-Stock

1+ parts

$0.796

100+ parts

-

1k+ parts

-

10k+ parts

-

609

$0.796

-

-

-

Modulus Dynamics

Lithuania . 15,641 parts In-Stock

1+ parts

$0.928

100+ parts

$0.891

1k+ parts

$0.854

10k+ parts

-

15,641

$0.928

$0.891

$0.854

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Argo Parts USA

USA . 2,601 parts In-Stock

1+ parts

$0.965

100+ parts

-

1k+ parts

-

10k+ parts

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2,601

$0.965

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-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.965

100+ parts

-

1k+ parts

$0.917

10k+ parts

$0.897

100

$0.965

-

$0.917

$0.897

Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

$1.540

100+ parts

$1.110

1k+ parts

$0.709

10k+ parts

-

1,000

$1.540

$1.110

$0.709

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Microchip USA

USA . 7,071 parts In-Stock

1+ parts

$13.065

100+ parts

-

1k+ parts

-

10k+ parts

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7,071

$13.065

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Perfect Parts

USA . 195 parts In-Stock

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195

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Overview

Power up your projects with the IPA060N06NXKSA1 from Infineon Technologies! As a leading manufacturer in the field of Power Field Effect Transistors (FET), Infineon delivers top-quality products that are reliable and efficient. Ideal for switching applications, this N-CHANNEL transistor offers a maximum drain current of 45A and a low on-resistance of 0.006 ohms, providing high performance and durability. Whether you're working on automotive, industrial, or consumer electronics projects, the IPA060N06NXKSA1 will provide the power and efficiency you need to bring your designs to life. Elevate your work with the Infineon advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good insulation and protection for the transistor, ensuring reliable performance and durability in various conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher conductivity, making them efficient for switching applications and providing better overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from voltage spikes and reverse current, enhancing the reliability and safety of the system where this transistor is used.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance, making it ideal for efficient power control and management.

Minimum DS Breakdown Voltage: 60 V

With a high minimum breakdown voltage, this FET can handle higher voltages without failure, providing a safety margin for the circuit and ensuring reliable operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation on circuit boards or heat sinks, making it convenient to use in various electronic applications.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and stability when soldered onto a PCB or wiring, ensuring a reliable electrical connection and preventing potential issues.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and require less drive voltage, making them efficient for switching applications and providing improved overall performance.

Maximum Pulsed Drain Current (IDM): 180 A

With a high maximum pulsed drain current rating, this FET can handle short-term peak currents without damage, making it suitable for demanding applications with high current requirements.

Avalanche Energy Rating (EAS): 60 mJ

The high avalanche energy rating of 60 mJ indicates that this FET can withstand energy spikes and transient overloads, ensuring reliable performance in challenging operating conditions.

No. of Terminals: 3

Having 3 terminals allows for easy connection and integration into circuits, providing versatility and flexibility in design and application of this FET.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting of the FET on heat sinks or chassis, ensuring good thermal management and long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good efficiency, low power consumption, and high reliability, making this FET a suitable choice for various electronic applications.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistor elements, providing good performance characteristics and reliability, making this FET a dependable choice for different applications.

Terminal Finish: TIN

The tin terminal finish offers good conductivity and solderability, ensuring reliable electrical connections and preventing issues like corrosion or poor contact in the long term.

Maximum Drain Current (ID): 45 A

With a maximum drain current rating of 45 A, this FET can handle high continuous current without overheating or damage, ensuring stable and efficient operation in demanding applications.

Maximum Drain-Source On Resistance: 0.006 ohm

The low on-resistance of 0.006 ohm reduces power losses and heat generation in the FET, improving efficiency and performance in power control and switching applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and connection of this FET in circuits, making it user-friendly and easy to integrate into various electronic systems.

Case Connection: ISOLATED

The isolated case connection helps to prevent electrical interference or short circuits, ensuring reliable and safe operation of the FET in different electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) IPA060N06NXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

180 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA060N06NXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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