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FM25VN10-GTR

Infineon Technologies

FM25VN10-GTR by Infineon Technologies

Infineon's FM25VN10-GTR FRAM features 128KX8 organization, operates at 3.3V with 40MHz clock frequency. Ideal for applications requiring high endurance like industrial automation and IoT due to its 100Tb write/erase cycles and SPI serial bus interface.

Median Price

$17.820

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,299 parts In-Stock

1+ parts

$17.820

100+ parts

$15.240

1k+ parts

$14.300

10k+ parts

$13.800

6,299

$17.820

$15.240

$14.300

$13.800

DigiKey

USA . 2,230 parts In-Stock

1+ parts

$17.820

100+ parts

$15.237

1k+ parts

$14.361

10k+ parts

$13.525

2,230

$17.820

$15.237

$14.361

$13.525

Flip Electronics (Authorized)

USA . 1,940 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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1,940

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Distributors (In-Stock)

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Digiode

USA . 274 parts In-Stock

1+ parts

$14.782

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$14.782

-

-

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Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

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Vyrian

USA . 2,073 parts In-Stock

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2,073

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 936 parts In-Stock

1+ parts

$14.004

100+ parts

-

1k+ parts

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10k+ parts

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936

$14.004

-

-

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Ampacity Inc.

Singapore . 1,875 parts In-Stock

1+ parts

$27.140

100+ parts

-

1k+ parts

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10k+ parts

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1,875

$27.140

-

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Component Stockers USA

USA . 590 parts In-Stock

1+ parts

$204.140

100+ parts

-

1k+ parts

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10k+ parts

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590

$204.140

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Argo Parts USA

USA . 1,927 parts In-Stock

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1,927

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Continental Prestige Electronics

USA . 1,270 parts In-Stock

1+ parts

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1,270

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Advanced Electronics

New Zealand . 27 parts In-Stock

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27

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Overview

Experience faster and more reliable data storage with the FM25VN10-GTR by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies brings you FRAM technology that offers superior endurance with 100 trillion write/erase cycles. Ideal for applications requiring high-speed data retention, this FRAM boasts a small outline package and operates synchronously at a clock frequency of up to 40 MHz. With a wide operating temperature range, dual terminal position, and hardware/software write protection, this product delivers exceptional value and performance for your electronic devices. Upgrade your systems today with the FM25VN10-GTR and enjoy seamless data handling like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures energy efficiency and compatibility with standard power sources.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for efficient communication and data transfer between the FRAM and other components in the system.

Memory Density: 1048576 bit

With a high memory density, this FRAM can store a large amount of data, making it suitable for applications requiring extensive data storage.

Endurance: 100000000000000 Write/Erase Cycles

The incredibly high endurance of this FRAM ensures long-term reliability and durability, making it a cost-effective choice for applications that involve frequent write and erase operations.

Serial Bus Type: SPI

The Serial Peripheral Interface (SPI) bus type allows for fast and efficient data transfer between the FRAM and other devices, enhancing overall system performance.

Technical Specifications

FRAMs FM25VN10-GTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 25MHZ FROM 2.0-2.7V SUPPLY AND 4KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

40 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.727 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00015 Amp

Minimum Standby Voltage:

2.7 V

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Write Protection:

HARDWARE/SOFTWARE

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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