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FM24VN10-GTR

Infineon Technologies

FM24VN10-GTR by Infineon Technologies

FM24VN10-GTR by Infineon Technologies is a FRAM with 128KX8 organization, operating at 3.4 MHz clock frequency. It has a memory density of 1048576 bit and offers 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.

Median Price

$12.875

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 400 parts In-Stock

1+ parts

$16.100

100+ parts

$9.650

1k+ parts

$9.250

10k+ parts

$7.720

400

$16.100

$9.650

$9.250

$7.720

Flip Electronics (Authorized)

USA . 19,550 parts In-Stock

1+ parts

-

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19,550

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Verical

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$9.650

1k+ parts

$9.250

10k+ parts

-

400

-

$9.650

$9.250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 19,214 parts In-Stock

1+ parts

-

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19,214

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 718 parts In-Stock

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718

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Semicontronic

India . 9,807 parts In-Stock

1+ parts

$13.260

100+ parts

$12.928

1k+ parts

$12.862

10k+ parts

-

9,807

$13.260

$12.928

$12.862

-

Ampacity Inc.

Singapore . 9,709 parts In-Stock

1+ parts

$13.520

100+ parts

-

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9,709

$13.520

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Microchip USA

USA . 105 parts In-Stock

1+ parts

$31.213

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105

$31.213

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Component Stockers USA

USA . 422 parts In-Stock

1+ parts

$97.360

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422

$97.360

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Metaverse IC Inc.

Canada . 7,500 parts In-Stock

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7,500

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A-Z Elektronik GmbH

Germany . 7,190 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,212 parts In-Stock

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Kepictronics

USA . 5,163 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,793 parts In-Stock

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4,793

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Argo Parts USA

USA . 2,937 parts In-Stock

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2,937

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Continental Prestige Electronics

USA . 1,169 parts In-Stock

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1,169

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Corphita

USA . 686 parts In-Stock

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686

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Perfect Parts

USA . 9 parts In-Stock

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9

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Overview

Unlock the power of innovation with the FM24VN10-GTR by Infineon Technologies, a cutting-edge FRAM memory solution that guarantees top-notch quality and reliability. Infineon's unrivaled expertise in semiconductor technology ensures that this product delivers exceptional performance and durability for a wide range of applications. Experience seamless operation, high-speed data processing, and enhanced efficiency with this advanced FRAM memory chip. Upgrade your systems today and discover the value and benefits that only Infineon can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the internal components of the FRAM, making it a reliable choice for long-term use.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for precise timing and control of data transfer, enhancing the overall performance and efficiency of the FRAM.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this FRAM is compatible with a wide range of electronic devices and systems, making it versatile and easy to integrate.

Memory Density: 1048576 bit

The high memory density of 1048576 bits allows for storing a large amount of data in a compact space, making this FRAM ideal for applications requiring high data storage capacity.

Endurance: 100000000000000 Write/Erase Cycles

The exceptional endurance of 100 trillion write/erase cycles ensures longevity and reliability, making this FRAM suitable for applications that involve frequent read and write operations.

Technical Specifications

FRAMs FM24VN10-GTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

3.4 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.727 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00015 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Write Protection:

HARDWARE

Trade Compliance

FM24VN10-GTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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