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DD104N16K

Infineon Technologies

DD104N16K by Infineon Technologies

DD104N16K by Infineon Technologies is a series connected rectifier diode with 2 elements, capable of handling up to 104A output current and 1600V peak reverse voltage. It is designed for applications requiring high power efficiency and reliability, such as industrial power supplies and motor drives. With a max operating temperature of 150°C, it ensures stable performance in demanding environments.

Median Price

$120.690

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 61 parts In-Stock

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$120.690

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Vyrian

USA . 409 parts In-Stock

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$28.572

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409

$28.572

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Forefront Electronics and Design

USA . 23 parts In-Stock

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$73.500

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Digiode

USA . 991 parts In-Stock

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$114.656

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991

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Tech-Mark Corp

USA . 15 parts In-Stock

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Holdelec - ElecDif-Pro

France . 10 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 3 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 19,695 parts In-Stock

1+ parts

$0.104

100+ parts

$0.100

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$0.096

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19,695

$0.104

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Native Components

USA . 446 parts In-Stock

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$5.180

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Corphita

USA . 51 parts In-Stock

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$108.621

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Northwest PG Solutions

USA . 1,518 parts In-Stock

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$5.076

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1,518

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$5.076

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Overview

Experience the superior quality and performance of the Infineon Technologies DD104N16K diode rectifier. With a reputation for excellence in manufacturing, Infineon delivers reliable products that meet the highest industry standards. Ideal for a wide range of applications, this series-connected device offers unparalleled value with its high output current, low forward voltage, and impressive peak reverse voltage capabilities. Trust Infineon to power your projects with cutting-edge technology and unmatched reliability.

Feature Benefit Bullets

Config: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Series connection and center tap design provide stability and balanced performance.

Maximum Reverse Current: 20000 uA

High maximum reverse current rating ensures efficient operation and reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into various circuit designs.

No. of Terminals: 3

3 terminals provide flexibility in connectivity options and ease of installation.

Package Style: FLANGE MOUNT

Flange mount style offers secure attachment and heat dissipation capabilities.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance in demanding conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for versatility in application environments.

Terminal Position: UPPER

Upper terminal position is convenient for wiring and connection in circuits.

Case Connection: ISOLATED

Isolated case connection enhances safety and prevents circuit interference.

Reference Standard: UL RECOGNIZED

UL recognized standard ensures compliance with safety and quality regulations.

Diode Type: RECTIFIER DIODE

Rectifier diode type is ideal for converting AC to DC current with minimal loss.

Maximum Forward Voltage (VF): 1.4 V

Low forward voltage drop ensures energy efficiency and reduces power loss.

Maximum Output Current: 104 A

High maximum output current rating allows for handling large loads and peak currents.

No. of Elements: 2

Dual diode elements provide redundancy and higher current capacity.

Maximum Repetitive Peak Reverse Voltage: 1600 V

High maximum reverse voltage rating ensures reliable operation in high voltage applications.

Maximum Non Repetitive Peak Forward Current: 2500 A

High maximum non-repetitive peak forward current rating allows for handling surge currents.

Diode Element Material: SILICON

Silicon diode element material offers high performance and durability.

Technical Specifications

Diodes & Rectifiers DD104N16K attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Application:

GENERAL PURPOSE

Case Connection:

ISOLATED

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.4 V

JESD-30 Code:

R-XUFM-X3

Maximum Non Repetitive Peak Forward Current:

2500 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

104 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Reverse Voltage:

1600 V

Maximum Reverse Current:

20000 uA

Surface Mount:

NO

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

DD104N16K Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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