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CY9BF164KPMC-G-JNE2

Infineon Technologies

CY9BF164KPMC-G-JNE2 by Infineon Technologies

Infineon's CY9BF164KPMC-G-JNE2 is a 32-bit microcontroller with 294912 ROM words, 32768 RAM bytes, and max clock frequency of 48 MHz. Ideal for automotive applications, it features ADC/DAC channels, DMA support, and various peripherals like RTC and WDT.

Median Price

$5.906

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$6.563

1k+ parts

$5.875

10k+ parts

$5.525

1,000

-

$6.563

$5.875

$5.525

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$5.250

1k+ parts

$4.700

10k+ parts

$4.420

1,000

-

$5.250

$4.700

$4.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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650

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-

-

-

Vyrian

USA . 543 parts In-Stock

1+ parts

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-

1k+ parts

-

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543

-

-

-

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Digiode

USA . 273 parts In-Stock

1+ parts

-

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-

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273

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,322 parts In-Stock

1+ parts

$16.464

100+ parts

-

1k+ parts

-

10k+ parts

-

2,322

$16.464

-

-

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Modulus Dynamics

Lithuania . 1,459 parts In-Stock

1+ parts

$17.664

100+ parts

$16.957

1k+ parts

$16.251

10k+ parts

-

1,459

$17.664

$16.957

$16.251

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

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1,000

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-

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Corphita

USA . 662 parts In-Stock

1+ parts

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662

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Overview

Unlock the power of cutting-edge technology with the CY9BF164KPMC-G-JNE2 by Infineon Technologies. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability. Ideal for automotive applications, this advanced device boasts a wide range of features including multiple ADC and DAC channels, DMA capabilities, and a maximum clock frequency of 48 MHz. Experience seamless connectivity with CSIO, I2C, LIN, and UART interfaces. Elevate your projects with this top-of-the-line microcontroller and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the microcontroller, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient circuit board assembly, saving manufacturing time and costs.

Maximum Supply Voltage: 5.5V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, offering flexibility in various applications.

Bit Size: 32

A 32-bit architecture provides high processing power and efficiency, enabling complex operations and calculations to be performed quickly.

DAC Channels: YES

Digital-to-Analog Converter channels allow for accurate conversion of digital signals to analog outputs, expanding the range of possible applications for the microcontroller.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with other components and peripherals, enhancing the versatility of the microcontroller.

Minimum Supply Voltage: 2.7V

A low minimum supply voltage requirement allows for operation in power-constrained environments, making this microcontroller suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliability and stable performance even under harsh environmental conditions, such as automotive or industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

With a Reduced Instruction Set Computing (RISC) architecture, this microcontroller offers efficient processing capabilities, enabling high-speed operation and low power consumption.

RAM Bytes: 32768

A large RAM capacity of 32 KB allows for storing and accessing a significant amount of data, enabling advanced multitasking and memory-intensive applications.

Technical Specifications

Microcontrollers CY9BF164KPMC-G-JNE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

32768

ROM Words:

294912

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

160 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CSIO(5), I2C(6), LIN(5), UART(5)

Peripherals:

DMA(8), POR, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

CY9BF164KPMC-G-JNE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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