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CY96F673RBPMC1-GS-UJE1

Infineon Technologies

CY96F673RBPMC1-GS-UJE1 by Infineon Technologies

Infineon's CY96F673RBPMC1-GS-UJE1 microcontroller features 16-bit CPU, 4096 bytes RAM, and 12-Ch 10-Bit ADC for applications like CAN, I2C, USART(2) connectivity. With a max clock frequency of 8 MHz and low power mode support, it is ideal for embedded systems requiring high-speed processing and energy efficiency. The package style is flatpack with a terminal pitch of 0.5 mm and a max seated height of 1.7 mm.

Median Price

$4.208

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

8,000

-

$3.740

$3.350

$3.150

Verical

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

$4.675

1k+ parts

$4.188

10k+ parts

$3.938

8,000

-

$4.675

$4.188

$3.938

Distributors (In-Stock)

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Digiode

USA . 260 parts In-Stock

1+ parts

$4.161

100+ parts

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260

$4.161

-

-

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Vyrian

USA . 582 parts In-Stock

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582

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 774 parts In-Stock

1+ parts

$3.720

100+ parts

-

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774

$3.720

-

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Semicontronic

India . 743 parts In-Stock

1+ parts

$3.720

100+ parts

$3.627

1k+ parts

$3.608

10k+ parts

-

743

$3.720

$3.627

$3.608

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Corphita

USA . 502 parts In-Stock

1+ parts

$3.942

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502

$3.942

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$8.554

100+ parts

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744

$8.554

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Aztec Data Supply Inc.

USA . 272 parts In-Stock

1+ parts

$42.290

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272

$42.290

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Corohmni

South Africa . 738 parts In-Stock

1+ parts

$47.698

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738

$47.698

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Modulus Dynamics

Lithuania . 3,294 parts In-Stock

1+ parts

$81.105

100+ parts

$77.861

1k+ parts

$74.617

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-

3,294

$81.105

$77.861

$74.617

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QUARKTWIN TECHNOLOGY LTD

USA . 21,699 parts In-Stock

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21,699

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Microchip USA

USA . 4,105 parts In-Stock

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4,105

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Argo Parts USA

USA . 3,604 parts In-Stock

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3,604

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Continental Prestige Electronics

USA . 1,608 parts In-Stock

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1,608

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Advanced Electronics

New Zealand . 445 parts In-Stock

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445

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Overview

Unlock the potential of your electronic designs with the CY96F673RBPMC1-GS-UJE1 microcontroller by Infineon Technologies. Manufactured to the highest standards, this powerful device offers a wide range of applications in various industries. From automotive to consumer electronics, the possibilities are endless with its exceptional performance and reliability. Experience enhanced functionality, efficiency, and innovation with this cutting-edge product that delivers value and benefits to customers seeking top-notch quality in their projects. Elevate your designs with the CY96F673RBPMC1-GS-UJE1 and unleash limitless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

No. of Terminals: 64

Offers ample connectivity options for external devices and peripherals, enhancing the microcontroller's versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes efficient RISC architecture for improved performance and power efficiency in processing tasks.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with various sensors and external analog signals.

Connectivity: CAN, I2C, USART(2)

Supports multiple communication protocols, increasing compatibility with a wide range of devices and applications.

Technical Specifications

Microcontrollers CY96F673RBPMC1-GS-UJE1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

F2MC-16FX

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

2

No. of External Interrupts:

7

No. of I/O Lines:

50

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

4096

ROM Words:

98816

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

32 rpm

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN, I2C, USART(2)

Peripherals:

DMA(2), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

CY96F673RBPMC1-GS-UJE1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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