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CY96F338RSAPMC-GS-UJE2

Infineon Technologies

CY96F338RSAPMC-GS-UJE2 by Infineon Technologies

Infineon's CY96F338RSAPMC-GS-UJE2 microcontroller features 16-bit size, 24-bit address bus width, and 48 MHz clock frequency. Ideal for automotive applications with its low profile flatpack package style and RISC technology, offering PWM and ADC channels along with DMA support.

Median Price

$35.528

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$35.528

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50

$35.528

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Vyrian

USA . 1,627 parts In-Stock

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1,627

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Digiode

USA . 277 parts In-Stock

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277

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Chip Stock

USA . 231 parts In-Stock

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231

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 646 parts In-Stock

1+ parts

$13.611

100+ parts

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646

$13.611

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Ampacity Inc.

Singapore . 1,337 parts In-Stock

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$23.000

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1,337

$23.000

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Semicontronic

India . 590 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

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590

$27.000

$26.325

$26.190

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Continental Prestige Electronics

USA . 6,083 parts In-Stock

1+ parts

$35.528

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$34.817

6,083

$35.528

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$34.817

Aztec Data Supply Inc.

USA . 3,619 parts In-Stock

1+ parts

$38.750

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3,619

$38.750

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Modulus Dynamics

Lithuania . 2,678 parts In-Stock

1+ parts

$50.638

100+ parts

$48.612

1k+ parts

$46.587

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2,678

$50.638

$48.612

$46.587

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Corohmni

South Africa . 83 parts In-Stock

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$74.607

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83

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Argo Parts USA

USA . 3,846 parts In-Stock

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3,846

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Glotronic Ltd.

UK . 828 parts In-Stock

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828

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Corphita

USA . 517 parts In-Stock

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517

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Netroflash

USA . 500 parts In-Stock

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$34.817

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$33.751

10k+ parts

$33.041

500

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$34.817

$33.751

$33.041

Microchip USA

USA . 370 parts In-Stock

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370

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Overview

Unleash the power of innovation with the CY96F338RSAPMC-GS-UJE2 by Infineon Technologies. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. Whether you're diving into automotive electronics or exploring IoT solutions, this cutting-edge device delivers seamless operation and efficiency. Elevate your projects with Infineon's top-notch technology and discover a world of possibilities at your fingertips. Experience excellence like never before with the CY96F338RSAPMC-GS-UJE2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the microcontroller suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle higher power requirements while maintaining stability.

Address Bus Width: 24

A wider address bus width allows for greater memory addressing capabilities, making the microcontroller suitable for complex applications.

Package Shape: SQUARE

The square package shape provides good stability and ease of mounting on the PCB.

Bit Size: 16

A 16-bit architecture allows for efficient processing of data and instructions, enhancing overall performance.

No. of Terminals: 144

With a higher number of terminals, this microcontroller offers greater connectivity options for external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style with low profile and fine pitch design allows for compact and space-saving PCB layouts.

Minimum Supply Voltage: 3 V

The microcontroller can operate efficiently at lower supply voltages, conserving power and reducing heat generation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller is suitable for use in harsh environments or industrial applications.

Minimum Operating Temperature: -40 °C

The microcontroller can function reliably even in extremely cold temperatures, making it versatile for various operating conditions.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its application possibilities.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and reduce CPU load, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position allows for easy orientation and installation on the PCB, simplifying the assembly process.

Maximum Seated Height: 1.7 mm

The low profile design with a maximum seated height of 1.7mm saves space and enables compact device designs.

Width: 20 mm

With a compact width of 20mm, the microcontroller can fit into small form factor devices while maintaining functionality.

External Data Bus Width: 16

A wider external data bus width allows for faster data transfer between the microcontroller and external memory or peripherals.

Maximum Clock Frequency: 48 MHz

Operating at a maximum clock frequency of 48MHz, this microcontroller offers high-speed processing for demanding applications.

Length: 20 mm

The compact length of 20mm ensures that the microcontroller can fit into tight spaces without sacrificing performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the stringent environmental and reliability requirements of the automotive industry.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture, this microcontroller offers high performance and energy efficiency for a wide range of embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and provides a strong mechanical connection to the PCB.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this microcontroller is compatible with a wide range of power sources.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of output signals, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and customization, ensuring the microcontroller can adapt to changing requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller offers high-density mounting capabilities for space-constrained designs.

Speed: 48 rpm

Operating at a speed of 48rpm, this microcontroller provides efficient processing and response times for real-time applications.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8 bits, the microcontroller can store and execute program instructions efficiently.

No. of I/O Lines: 124

A high number of I/O lines provide ample connectivity options for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers CY96F338RSAPMC-GS-UJE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

No. of I/O Lines:

124

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

CY96F338RSAPMC-GS-UJE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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