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CY96F338USAPMC-GS-UJE2

Infineon Technologies

CY96F338USAPMC-GS-UJE2 by Infineon Technologies

Infineon's CY96F338USAPMC-GS-UJE2 is a 16-bit microcontroller with 24-bit address bus, operating at up to 48 MHz. Suitable for industrial applications, it features 120 I/O lines, PWM and ADC channels, and ROM programmability. The compact package style includes a low-profile flatpack design with quad terminals and Gull Wing form factor.

Median Price

$48.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

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$36.470

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650

$36.470

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Vyrian

USA . 1,497 parts In-Stock

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HZD GmbH

Germany . 1,200 parts In-Stock

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Rutronik

Germany . 600 parts In-Stock

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$59.730

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600

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$59.730

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Digiode

USA . 217 parts In-Stock

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217

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Avant Electronics Limited

UK . 167 parts In-Stock

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167

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Distributors (Availability)

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AZTECH Wire

Italy . 424 parts In-Stock

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$13.699

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424

$13.699

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Semicontronic

India . 1,411 parts In-Stock

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$14.000

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$13.650

1k+ parts

$13.580

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1,411

$14.000

$13.650

$13.580

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Ampacity Inc.

Singapore . 1,532 parts In-Stock

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$18.000

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$18.000

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Continental Prestige Electronics

USA . 6,163 parts In-Stock

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$36.470

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$35.741

6,163

$36.470

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$35.741

Netroflash

USA . 100 parts In-Stock

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$36.470

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100

$36.470

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Modulus Dynamics

Lithuania . 1,061 parts In-Stock

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$38.083

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$36.560

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$35.036

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1,061

$38.083

$36.560

$35.036

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Aztec Data Supply Inc.

USA . 1,202 parts In-Stock

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$52.530

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$52.530

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Corohmni

South Africa . 745 parts In-Stock

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$58.995

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QUARKTWIN TECHNOLOGY LTD

USA . 19,334 parts In-Stock

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Microchip USA

USA . 5,002 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 477 parts In-Stock

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Corphita

USA . 67 parts In-Stock

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67

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the CY96F338USAPMC-GS-UJE2 microcontroller by Infineon Technologies. Crafted with precision and expertise, this versatile device offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this product delivers top-notch quality and efficiency, setting new standards in the industry. Experience seamless operation, advanced features, and robust design, making it the ideal choice for your next project. Upgrade your systems with the CY96F338USAPMC-GS-UJE2 and witness a whole new world of possibilities unfold before your eyes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and low cost, making it a reliable choice for various applications.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly processes.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can accommodate a wide range of power sources, increasing versatility.

Address Bus Width: 24

The wide address bus width allows for efficient memory addressing, enhancing the performance of the microcontroller in data-intensive applications.

Package Shape: SQUARE

The square shape of the package provides uniformity in design and facilitates compact integration into electronic devices.

Bit Size: 16

The 16-bit architecture offers a balance between cost and performance, making it suitable for a variety of embedded systems.

No. of Terminals: 144

The high number of terminals enables connectivity to a wide range of external devices, expanding the functionality of the microcontroller.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a space-efficient design with improved thermal performance, making it ideal for compact electronic devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage enables energy-efficient operation while still providing enough power for reliable performance.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, ensuring reliability in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold environments, making it suitable for a wide range of industrial applications.

Terminal Finish: Tin (Sn)

The tin terminal finish provides corrosion resistance and solderability, ensuring long-lasting reliability in different operating conditions.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows for the conversion of analog signals to digital data, enabling interfacing with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and reduce the burden on the CPU, improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers secure and stable connections, ensuring reliable signal transmission in demanding applications.

Maximum Seated Height: 1.7 mm

The low maximum seated height enables slim and compact designs, making this microcontroller suitable for space-constrained applications.

Width: 20 mm

The moderate width allows for easy integration into various electronic systems, providing flexibility in design and layout.

External Data Bus Width: 16

The wide external data bus width facilitates fast data transfer between the microcontroller and external memory devices, enhancing system performance.

Maximum Clock Frequency: 48 MHz

With a high maximum clock frequency, this microcontroller can execute instructions quickly, making it suitable for high-speed applications.

Length: 20 mm

The moderate length contributes to a compact form factor, allowing for versatile placement in different electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making this microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller provides high performance with reduced power consumption, making it suitable for battery-powered devices.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections, ensuring stable electrical connections in demanding operating conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides compatibility with standard power sources, making integration easier in various electronic systems.

PWM Channels: YES

The presence of Pulse-Width Modulation channels allows for precise control of power outputs, making this microcontroller ideal for motor control and power management applications.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy updating of firmware, enabling flexibility in software development and maintenance.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density mounting on circuit boards, providing space-saving benefits in compact electronic designs.

Speed: 48 rpm

The speed of 48 revolutions per minute (rpm) allows for fast data processing and execution of instructions, enhancing overall system performance.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits allows for storing and executing program instructions efficiently, enhancing the microcontroller's processing capabilities.

No. of I/O Lines: 120

The high number of Input/Output lines provides ample connectivity options for interfacing with various external devices, making this microcontroller versatile for different applications.

Technical Specifications

Microcontrollers CY96F338USAPMC-GS-UJE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

No. of I/O Lines:

120

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

CY96F338USAPMC-GS-UJE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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