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BTS621L1E3128A

Infineon Technologies

BTS621L1E3128A by Infineon Technologies

BTS621L1E3128A by Infineon: Peripheral driver with 2 functions, MOS tech, 3.5A max output current, and built-in protections. Ideal for applications requiring a 12/24V power supply, such as automotive systems or industrial automation. Package style is flange mount with dimensions of 9.2mm x 9.9mm for compact designs.

Median Price

$5.390

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 204 parts In-Stock

1+ parts

$5.390

100+ parts

$3.970

1k+ parts

$2.850

10k+ parts

$2.700

204

$5.390

$3.970

$2.850

$2.700

Distributors (In-Stock)

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Digiode

USA . 285 parts In-Stock

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$5.120

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-

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285

$5.120

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Component Electronics Inc.

Canada . 52 parts In-Stock

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$11.540

100+ parts

$8.650

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$7.500

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52

$11.540

$8.650

$7.500

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VNN

France . 4,358 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4,022 parts In-Stock

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Rutronik

Germany . 1,000 parts In-Stock

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$2.430

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Vyrian

USA . 614 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Sunrise Surplus Inc.

USA . 54 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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Holdelec - ElecDif-Pro

France . 7 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 204 parts In-Stock

1+ parts

$4.580

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Corphita

USA . 192 parts In-Stock

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$4.851

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Corohmni

South Africa . 692 parts In-Stock

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$5.200

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Modulus Dynamics

Lithuania . 273 parts In-Stock

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$11.299

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$10.847

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$10.395

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273

$11.299

$10.847

$10.395

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AZTECH Wire

Italy . 614 parts In-Stock

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$17.983

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A-Z Elektronik GmbH

Germany . 13,171 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,187 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Lixinc

USA . 3,501 parts In-Stock

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Argo Parts USA

USA . 3,335 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 1,090 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Microchip USA

USA . 205 parts In-Stock

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Overview

Unlock the full potential of your electronic devices with the BTS621L1E3128A by Infineon Technologies. This top-of-the-line peripheral driver offers unmatched quality and reliability, backed by a trusted manufacturer. Perfect for a wide range of applications, this product provides built-in protections against various electrical issues, ensuring peace of mind for customers. With a maximum output current of 3.5 A and a nominal output peak current limit of 14 A, this driver delivers exceptional performance and efficiency. Upgrade your systems today and experience the value and benefits that the BTS621L1E3128A has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 34 V

The high maximum supply voltage of 34V provides flexibility and compatibility with a wide range of power sources.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the peripheral driver, protecting it from various potential risks and faults.

Nominal Output Peak Current Limit: 14 A

The high output peak current limit of 14A allows the peripheral driver to handle high current loads efficiently and reliably.

Technical Specifications

Peripheral Drivers BTS621L1E3128A attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Length:

9.9 mm

No. of Functions:

2

No. of Terminals:

6

Output Current Flow Direction:

SOURCE

Maximum Output Current:

3.5 A

Nominal Output Peak Current Limit:

14 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP7H,.55,50TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

12/24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Turn-off Time:

400 us

Turn-on Time:

400 us

Width:

9.2 mm

Trade Compliance

BTS621L1E3128A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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