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BTS121ANKSA1

Infineon Technologies

BTS121ANKSA1 by Infineon Technologies

BTS121ANKSA1 by Infineon is a N-CHANNEL FET with 100V DS breakdown voltage and 88A IDM. It features a built-in diode, temp sensor, and 0.1 ohm RDS(on), ideal for switching applications. Operating in enhancement mode at up to 150°C, it has a rectangular package with through-hole terminals.

Median Price

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2

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1k+

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Vyrian

USA . 4,905 parts In-Stock

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Digiode

USA . 737 parts In-Stock

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Modulus Dynamics

Lithuania . 4,221 parts In-Stock

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$3.808

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$3.656

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$3.503

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AZTECH Wire

Italy . 806 parts In-Stock

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$14.900

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Microchip USA

USA . 6,901 parts In-Stock

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$26.520

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Futuretech Components

Singapore . 1,800 parts In-Stock

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Northwest PG Solutions

USA . 1,121 parts In-Stock

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Native Components

USA . 908 parts In-Stock

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Corphita

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Overview

Upgrade your power systems with the BTS121ANKSA1 by Infineon Technologies. Crafted with precision and expertise, this N-channel Power FET offers seamless switching capabilities for enhanced performance. With a built-in diode and temperature sensor, this transistor ensures reliability and efficiency in various applications. Experience the benefits of its 100V minimum DS breakdown voltage, 88A maximum pulsed drain current, and 0.1 ohm maximum drain-source on resistance. Trust in the quality and innovation that Infineon Technologies brings to the table and elevate your power solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and control in the N-channel configuration.

Configuration: SINGLE WITH BUILT-IN DIODE AND TEMPERATURE SENSOR

Convenient integration of a diode and temperature sensor enhances the functionality of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in this function.

Minimum DS Breakdown Voltage: 100 V

Can withstand high voltages, making it suitable for a wide range of applications requiring high voltage tolerance.

Package Shape: RECTANGULAR

Allows for easy and efficient mounting in various systems or circuits.

Terminal Form: THROUGH-HOLE

Facilitates easy installation and removal of the transistor from a circuit board or system.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides precise control over the transistor's conductance, improving overall circuit efficiency.

Maximum Pulsed Drain Current (IDM): 88 A

Ability to handle high pulsed currents, making it suitable for applications requiring periodic high power outputs.

No. of Terminals: 3

Simple and straightforward connection with only three terminals.

Package Style (Meter): FLANGE MOUNT

Offers a secure and stable mounting option for the transistor in various systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes reliable metal-oxide semiconductor technology for efficient and stable transistor performance.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance or reliability.

Transistor Element Material: SILICON

Silicon material provides good thermal stability and electrical properties for reliable operation.

Maximum Drain Current (ID): 22 A

Capable of handling high continuous drain currents, suitable for various power applications.

Maximum Drain-Source On Resistance: 0.1 ohm

Low drain-source on resistance minimizes power loss and heat generation in the transistor.

Terminal Position: SINGLE

Single terminal position simplifies connection and installation process.

Case Connection: DRAIN

Drain connection configuration for efficient current flow and control within the transistor.

Technical Specifications

Power Field Effect Transistors (FET) BTS121ANKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

88 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BTS121ANKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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