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BTN7960B

Infineon Technologies

BTN7960B by Infineon Technologies

BTN7960B by Infineon Technologies is a MOS technology peripheral driver with 7 terminals. It offers built-in protections for transient, over current, and over voltage. With a nominal output peak current limit of 62A, it is ideal for half bridge based applications requiring fast turn-on/off times.

Median Price

$4.397

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.397

10k+ parts

$3.938

5,000

-

-

$4.397

$3.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 20,900 parts In-Stock

1+ parts

$10.583

100+ parts

-

1k+ parts

-

10k+ parts

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20,900

$10.583

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Pegasus Components GmbH

Germany . 2,025 parts In-Stock

1+ parts

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2,025

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Digiode

USA . 929 parts In-Stock

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929

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Digital Electronic Gebert Verwaltungs UG

Germany . 750 parts In-Stock

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750

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VNN

France . 742 parts In-Stock

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742

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Vyrian

USA . 590 parts In-Stock

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590

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Bristol Electronics

USA . 17 parts In-Stock

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17

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Atlantic Semiconductor

USA . 17 parts In-Stock

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17

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ComSIT Distribution GmbH

Germany . 15 parts In-Stock

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15

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Nova Conductors

Japan . 10 parts In-Stock

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10

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NPI Materials, Inc.

USA . 3 parts In-Stock

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3

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Mil-Aero Solutions, Inc.

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,442 parts In-Stock

1+ parts

$0.500

100+ parts

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1,442

$0.500

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Benley Electronics

USA . 1 parts In-Stock

1+ parts

$4.000

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1

$4.000

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Modulus Dynamics

Lithuania . 999 parts In-Stock

1+ parts

$9.584

100+ parts

$9.201

1k+ parts

$8.817

10k+ parts

-

999

$9.584

$9.201

$8.817

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AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$9.685

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873

$9.685

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Epart123

USA . 9,000 parts In-Stock

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$4.700

10k+ parts

$4.700

9,000

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$4.700

$4.700

A-Z Elektronik GmbH

Germany . 8,876 parts In-Stock

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8,876

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Lixinc

USA . 8,798 parts In-Stock

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8,798

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Kepictronics

USA . 6,810 parts In-Stock

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6,810

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Perfect Parts

USA . 3,270 parts In-Stock

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3,270

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Futuretech Components

Singapore . 3,090 parts In-Stock

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3,090

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Alle Elektronik GmbH

Germany . 1,362 parts In-Stock

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1,362

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Corphita

USA . 911 parts In-Stock

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911

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Experience the superior quality and reliability of the BTN7960B by Infineon Technologies, a leading manufacturer known for its cutting-edge technology. This peripheral driver offers built-in protections against transient events, over current, over voltage, thermal issues, and more, ensuring optimal performance and longevity. With applications in a wide range of industries, this product provides value and benefits to customers looking for a high-quality solution that delivers exceptional results. Trust Infineon Technologies to meet your needs with the BTN7960B.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components, making this product reliable and long-lasting.

Maximum Supply Voltage: 18 V

Can handle high supply voltage, making it suitable for a variety of applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety of the device and connected components, minimizing the risk of damage from voltage spikes or overheating.

Nominal Output Peak Current Limit: 62 A

High peak current limit allows for efficient power delivery, making this peripheral driver suitable for demanding applications.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Half bridge-based design allows for efficient control and operation of peripheral devices, making it a versatile choice for various applications.

Technical Specifications

Peripheral Drivers BTN7960B attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

7

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

62 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Turn-off Time:

17 us

Turn-on Time:

25 us

Width:

9.25 mm

Trade Compliance

BTN7960B Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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