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BSS169L6327HTSA1

Infineon Technologies

BSS169L6327HTSA1 by Infineon Technologies

Infineon BSS169L6327HTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A ID, and 6Ω RDS(on). Ideal for depletion mode operation in small outline packages. Suitable for applications requiring low feedback capacitance and built-in diode configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 102,500 parts In-Stock

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Vyrian

USA . 2,006 parts In-Stock

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Digiode

USA . 81 parts In-Stock

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Nova Conductors

Japan . 29 parts In-Stock

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VNN

France . 9 parts In-Stock

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Modulus Dynamics

Lithuania . 2,704 parts In-Stock

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$0.809

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$0.777

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$0.744

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Corohmni

South Africa . 95 parts In-Stock

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$0.941

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Aztec Data Supply Inc.

USA . 283 parts In-Stock

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$1.220

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AZTECH Wire

Italy . 710 parts In-Stock

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$17.547

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Ampacity Inc.

Singapore . 189 parts In-Stock

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$41.050

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Semicontronic

India . 327 parts In-Stock

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$53.050

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$51.724

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$51.458

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327

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QUARKTWIN TECHNOLOGY LTD

USA . 25,462 parts In-Stock

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Continental Prestige Electronics

USA . 4,930 parts In-Stock

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Argo Parts USA

USA . 783 parts In-Stock

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Microchip USA

USA . 463 parts In-Stock

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Corphita

USA . 252 parts In-Stock

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Bastille Electronics

Australia . 47 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the BSS169L6327HTSA1 by Infineon Technologies. As a leading manufacturer in the field, you can trust in the quality and reliability of this N-channel small signal field-effect transistor. Whether you're working on amplifiers, voltage converters, or other applications, this single configuration with a built-in diode offers unmatched performance. With a minimum DS breakdown voltage of 100V and maximum drain current of 0.17A, this transistor provides the power and efficiency you need. Invest in the best and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable housing for the transistor, ensuring longevity and stability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and conductivity, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient and optimized circuit design, reducing the need for additional components.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this transistor can handle higher voltages, making it suitable for a wide range of applications.

Maximum Drain Current (ID): 0.17 A

Capable of handling a relatively high current, making it ideal for applications that require power amplification.

Maximum Drain-Source On Resistance: 6 ohm

Low on-resistance results in minimal power loss and efficient operation of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS169L6327HTSA1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

7 pF

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSS169L6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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