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BSS131L6327HTSA1

Infineon Technologies

BSS131L6327HTSA1 by Infineon Technologies

Infineon's BSS131L6327HTSA1 is a N-CHANNEL FET with 240V DS Breakdown Voltage. Operating in Enhancement Mode, it has 0.11A ID and 14 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance and -55 to 150 °C operating range.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Chip Stock

USA . 241,070 parts In-Stock

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Vyrian

USA . 8,640 parts In-Stock

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Digiode

USA . 834 parts In-Stock

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834

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Nova Conductors

Japan . 450 parts In-Stock

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450

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VNN

France . 100 parts In-Stock

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100

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Contempo Components LLC

USA . 68 parts In-Stock

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Corohmni

South Africa . 122 parts In-Stock

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$0.322

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Aztec Data Supply Inc.

USA . 3,081 parts In-Stock

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$1.470

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Advanced Electronics

New Zealand . 3,649 parts In-Stock

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$1.473

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$1.399

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$1.399

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Modulus Dynamics

Lithuania . 21,408 parts In-Stock

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$1.846

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$1.772

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$1.698

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AZTECH Wire

Italy . 622 parts In-Stock

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$10.768

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Ampacity Inc.

Singapore . 982 parts In-Stock

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$27.050

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Semicontronic

India . 1,446 parts In-Stock

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$30.050

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$29.299

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$29.148

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Argo Parts USA

USA . 2,197 parts In-Stock

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Robosynatics

Brazil . 2,000 parts In-Stock

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Lucentia Tech

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,804 parts In-Stock

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Corphita

USA . 819 parts In-Stock

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Microchip USA

USA . 472 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the BSS131L6327HTSA1 by Infineon Technologies. Known for their top-notch quality and reliability, Infineon Technologies brings you a Small Signal Field Effect Transistor (FET) that is designed to exceed expectations. This N-channel transistor boasts a single configuration with a built-in diode, making it perfect for a wide range of applications. With a minimum breakdown voltage of 240V and maximum power dissipation of 0.36W, this transistor offers unparalleled performance and efficiency. Upgrade your projects with the BSS131L6327HTSA1 and experience the difference today!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type

N-CHANNEL - allows for efficient current flow and operation in electronic circuits.

Configuration

SINGLE WITH BUILT-IN DIODE - simplifies circuit design and saves space by integrating a diode within the transistor package.

Surface Mount

YES - facilitates easy and secure mounting on circuit boards for streamlined production processes.

Minimum DS Breakdown Voltage

240 V - ensures reliable performance and protection against voltage spikes.

Package Shape

RECTANGULAR - offers versatility in placement and mounting options for different circuit layouts.

Terminal Form

GULL WING - enables easy soldering and secure connections in electronic assemblies.

Operating Mode

ENHANCEMENT MODE - allows for enhanced control and precision in circuit operation.

No. of Terminals

3 - simplifies wiring connections and reduces complexity in circuit design.

Maximum Power Dissipation (Abs)

0.36 W - supports operation in a wide range of power applications without overheating.

Package Style (Meter)

SMALL OUTLINE - saves space and enhances circuit density in compact electronic devices.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - provides high performance and reliability in different operating conditions.

Maximum Operating Temperature

150 °C - ensures stable operation in various environments without performance degradation.

Transistor Element Material

SILICON - offers high efficiency and durability for long-lasting performance.

Minimum Operating Temperature

55 °C - allows for reliable operation even in extreme cold conditions.

Maximum Drain Current (ID)

0.11 A - supports high current flow for efficient operation in power circuits.

Maximum Drain-Source On Resistance

14 ohm - enables low power loss and efficient signal transmission in electronic circuits.

Terminal Position

DUAL - provides flexibility in circuit layout and connection options for different applications.

Maximum Feedback Capacitance (Crss)

4.2 pF - enhances signal stability and performance in high-frequency applications.

Reference Standard

AEC-Q101 - meets industry standards for quality and reliability in automotive electronic applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS131L6327HTSA1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

240 V

Maximum Drain Current (ID):

.11 A

Maximum Drain-Source On Resistance:

14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

4.2 pF

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSS131L6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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