Loading...

BSP603S2LNT

Infineon Technologies

BSP603S2LNT by Infineon Technologies

Infineon's BSP603S2LNT is a N-CHANNEL FET with 55V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 21A IDM, 150mJ EAS, and 0.04ohm RDS(ON). With ENHANCEMENT MODE operation and DUAL terminals in a SMALL OUTLINE package, it offers efficient performance up to 150°C.

Median Price

$0.360

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29,683 parts In-Stock

1+ parts

-

100+ parts

$0.339

1k+ parts

$0.281

10k+ parts

$0.251

29,683

-

$0.339

$0.281

$0.251

Verical

USA . 29,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.381

10k+ parts

$0.313

29,683

-

-

$0.381

$0.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 248 parts In-Stock

1+ parts

$0.264

100+ parts

-

1k+ parts

-

10k+ parts

-

248

$0.264

-

-

-

Vyrian

USA . 30,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,122

-

-

-

-

VNN

France . 5,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,736

-

-

-

-

Greenchips

USA . 3,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,034

-

-

-

-

SIE Connect GmbH - GreenChips

Germany . 3,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,034

-

-

-

-

Nova Conductors

Japan . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

800

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 29,716 parts In-Stock

1+ parts

$0.236

100+ parts

-

1k+ parts

-

10k+ parts

-

29,716

$0.236

-

-

-

Semicontronic

India . 29,477 parts In-Stock

1+ parts

$0.236

100+ parts

$0.230

1k+ parts

$0.229

10k+ parts

-

29,477

$0.236

$0.230

$0.229

-

Modulus Dynamics

Lithuania . 9,578 parts In-Stock

1+ parts

$0.248

100+ parts

$0.238

1k+ parts

$0.228

10k+ parts

-

9,578

$0.248

$0.238

$0.228

-

Corohmni

South Africa . 9 parts In-Stock

1+ parts

$0.248

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$0.248

-

-

-

Corphita

USA . 418 parts In-Stock

1+ parts

$0.250

100+ parts

-

1k+ parts

-

10k+ parts

-

418

$0.250

-

-

-

Aztec Data Supply Inc.

USA . 2,843 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

-

2,843

$1.430

-

-

-

Continental Prestige Electronics

USA . 2,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,011

-

-

-

-

Argo Parts USA

USA . 275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

275

-

-

-

-

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the BSP603S2LNT by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor boasts a single configuration with a built-in diode, perfect for switching applications. With a minimum DS breakdown voltage of 55V and maximum pulsed drain current of 21A, this transistor offers unparalleled performance and reliability. Say goodbye to inefficiency and hello to seamless functionality with the BSP603S2LNT, designed to elevate your projects to new heights. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching capabilities in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by offering a built-in diode for reverse current protection.

Transistor Application: SWITCHING

Ideal for applications where quick and efficient switching of electrical signals is required.

Surface Mount: YES

Enables easy and compact integration onto circuit boards.

Minimum DS Breakdown Voltage: 55 V

Can handle higher voltage levels, making it suitable for various power applications.

Package Shape: RECTANGULAR

Allows for easy placement and alignment on circuit boards.

Terminal Form: GULL WING

Facilitates simple and secure soldering connections.

Operating Mode: ENHANCEMENT MODE

Offers precise control over the transistor's operation for optimal performance.

Maximum Pulsed Drain Current (IDM): 21 A

Capable of handling high peak currents for short durations.

Avalanche Energy Rating (EAS): 150 mJ

Can withstand energy surges without damage, increasing reliability.

No. of Terminals: 4

Provides multiple connection points for versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space and allows for efficient board layout.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and reliability in various operating conditions.

Maximum Operating Temperature: 150 °C

Can operate efficiently in elevated temperature environments.

Transistor Element Material: SILICON

Provides stable and consistent performance over a wide range of operating conditions.

Maximum Drain Current (ID): 5.2 A

Sufficient current handling capacity for medium-power applications.

Maximum Drain-Source On Resistance: 0.04 ohm

Low resistance helps in minimizing power loss and improving efficiency.

Terminal Position: DUAL

Allows for flexible connection options in circuit designs.

Case Connection: DRAIN

Provides a secure connection point for the transistor's drain terminal.

Technical Specifications

Power Field Effect Transistors (FET) BSP603S2LNT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (ID):

5.2 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

21 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSP603S2LNT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 10