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BSO200P03SHXUMA1

Infineon Technologies

BSO200P03SHXUMA1 by Infineon Technologies

Infineon's BSO200P03SHXUMA1 is a P-CHANNEL FET with 30V DS Breakdown Voltage and 36.4A IDM. Ideal for power applications, it features a built-in diode, 0.02 ohm RDS(on), and 98mJ EAS rating. Suitable for enhancement mode operation in various electronic devices due to its small outline package and GULL WING terminals.

Median Price

$0.484

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,299 parts In-Stock

1+ parts

-

100+ parts

$0.591

1k+ parts

$0.490

10k+ parts

$0.437

18,299

-

$0.591

$0.490

$0.437

Verical

USA . 15,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.613

10k+ parts

$0.546

15,799

-

-

$0.613

$0.546

Arrow

USA . 2,500 parts In-Stock

1+ parts

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$0.377

2,500

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$0.377

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

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$0.344

2,500

-

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$0.344

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.628

100+ parts

-

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10

$0.628

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Chip Stock

USA . 15,386 parts In-Stock

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15,386

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Vyrian

USA . 4,570 parts In-Stock

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4,570

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VNN

France . 3,073 parts In-Stock

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3,073

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Digiode

USA . 518 parts In-Stock

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518

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,477 parts In-Stock

1+ parts

$0.292

100+ parts

-

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2,477

$0.292

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Aztec Data Supply Inc.

USA . 3,380 parts In-Stock

1+ parts

$0.365

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3,380

$0.365

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.615

100+ parts

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$0.591

10k+ parts

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500

$0.615

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$0.591

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Continental Prestige Electronics

USA . 6,712 parts In-Stock

1+ parts

$0.628

100+ parts

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$0.615

6,712

$0.628

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$0.615

Argo Parts USA

USA . 4,088 parts In-Stock

1+ parts

$0.628

100+ parts

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1k+ parts

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10k+ parts

$0.609

4,088

$0.628

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-

$0.609

Modulus Dynamics

Lithuania . 19,408 parts In-Stock

1+ parts

$0.694

100+ parts

$0.666

1k+ parts

$0.638

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-

19,408

$0.694

$0.666

$0.638

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Corohmni

South Africa . 913 parts In-Stock

1+ parts

$1.267

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913

$1.267

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AZTECH Wire

Italy . 154 parts In-Stock

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$16.830

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154

$16.830

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A-Z Elektronik GmbH

Germany . 9,999 parts In-Stock

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9,999

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Microchip USA

USA . 6,358 parts In-Stock

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6,358

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GreenTree Electronics

Israel . 698 parts In-Stock

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698

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Corphita

USA . 483 parts In-Stock

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483

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Perfect Parts

USA . 60 parts In-Stock

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60

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Overview

Upgrade your power systems with the BSO200P03SHXUMA1 by Infineon Technologies. Crafted with precision and expertise, this P-CHANNEL Power FET offers unparalleled performance and reliability for a range of applications. With a built-in diode and an impressive 30V breakdown voltage, this transistor ensures optimal power management in compact designs. Trust in the quality and innovation that Infineon Technologies brings to the table, and experience the efficiency and convenience that the BSO200P03SHXUMA1 delivers. Elevate your projects with this cutting-edge solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body makes this product lightweight and durable, ideal for various applications.

Polarity or Channel Type: P-CHANNEL

The P-channel polarity allows for efficient power management and control, making this FET a reliable choice for power electronics.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this FET simplifies circuit design and enhances overall efficiency, making it a convenient choice for power applications.

Surface Mount: YES

With surface mount capability, this FET can be easily installed on printed circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 30 V

The high minimum breakdown voltage ensures reliable performance and protection against voltage spikes, making this FET suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit designs, providing flexibility in layout and installation.

Terminal Form: GULL WING

The gull wing terminal form enables secure and reliable connections, ensuring stable operation and longevity of the FET.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation provides precise control over the FET's conductivity, allowing for efficient power management and optimal performance.

Maximum Pulsed Drain Current (IDM): 36.4 A

The high maximum pulsed drain current capacity allows for handling peak power demands, making this FET suitable for high-performance applications.

Avalanche Energy Rating (EAS): 98 mJ

The high avalanche energy rating ensures robustness and reliability under extreme conditions, making this FET a dependable choice for power electronics.

Technical Specifications

Power Field Effect Transistors (FET) BSO200P03SHXUMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

98 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

7.4 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

36.4 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSO200P03SHXUMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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