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BGX50AE6327XT

Infineon Technologies

BGX50AE6327XT by Infineon Technologies

Infineon BGX50AE6327XT is a bridge rectifier diode with 4 elements, max output current of 0.14A, and operating temp up to 150°C. Ideal for applications requiring small outline package style and surface mount capability in electronic circuits.

Median Price

$0.103

Lifecycle Status

EOL

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 20 parts In-Stock

1+ parts

$0.161

100+ parts

$0.161

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$0.161

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20

$0.161

$0.161

$0.161

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Chip1Stop

Japan . 111,000 parts In-Stock

1+ parts

-

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$0.084

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$0.084

Mouser Electronics

USA . 11,688 parts In-Stock

1+ parts

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$0.103

11,688

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-

$0.103

Distributors (In-Stock)

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Digiode

USA . 419 parts In-Stock

1+ parts

$0.153

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-

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419

$0.153

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.158

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-

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50

$0.158

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Vyrian

USA . 40,855 parts In-Stock

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40,855

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PC Components Company LLC

USA . 647 parts In-Stock

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647

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Bristol Electronics

USA . 647 parts In-Stock

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647

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VNN

France . 526 parts In-Stock

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526

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Distributors (Availability)

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Semicontronic

India . 40,532 parts In-Stock

1+ parts

$0.071

100+ parts

$0.069

1k+ parts

$0.069

10k+ parts

-

40,532

$0.071

$0.069

$0.069

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Aztec Data Supply Inc.

USA . 2,881 parts In-Stock

1+ parts

$0.082

100+ parts

-

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2,881

$0.082

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Corphita

USA . 377 parts In-Stock

1+ parts

$0.145

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377

$0.145

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Corohmni

South Africa . 211 parts In-Stock

1+ parts

$0.150

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211

$0.150

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Ampacity Inc.

Singapore . 40,785 parts In-Stock

1+ parts

$0.155

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40,785

$0.155

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Argo Parts USA

USA . 4,257 parts In-Stock

1+ parts

$0.158

100+ parts

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$0.153

4,257

$0.158

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-

$0.153

Continental Prestige Electronics

USA . 3,333 parts In-Stock

1+ parts

$0.158

100+ parts

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$0.155

3,333

$0.158

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-

$0.155

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

$0.150

10k+ parts

$0.147

50

$0.158

-

$0.150

$0.147

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.161

100+ parts

$0.161

1k+ parts

$0.161

10k+ parts

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20

$0.161

$0.161

$0.161

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Modulus Dynamics

Lithuania . 33,635 parts In-Stock

1+ parts

$0.188

100+ parts

$0.180

1k+ parts

$0.173

10k+ parts

-

33,635

$0.188

$0.180

$0.173

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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Overview

Upgrade your electronic devices with the BGX50AE6327XT from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality bridge rectifier diodes that are perfect for a wide range of applications. With a package body material of PLASTIC/EPOXY and a maximum operating temperature of 150 °C, this diode offers exceptional performance and reliability. The BGX50AE6327XT is designed for surface mount applications and features a small outline package style, making it easy to integrate into your projects. Trust Infineon Technologies for superior products that deliver value, benefits, and advantages to meet your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the diodes, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for various applications.

Terminal Finish: MATTE TIN

Enhances the conductivity of the terminals for better performance.

Maximum Power Dissipation: 0.21 W

Efficiently dissipates heat to prevent overheating.

Peak Reflow Temperature: 260 °C

Withstands high reflow temperatures during assembly processes.

Diode Type: BRIDGE RECTIFIER DIODE

Specifically designed for converting AC to DC, ideal for rectification in power supplies.

Technical Specifications

Bridge Rectifier Diodes BGX50AE6327XT attributes and parameters. Explore more Bridge Rectifier Diodes devices from Infineon Technologies

Specs

Case Connection:

CATHODE

Config:

BRIDGE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

4

No. of Phases:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.14 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.21 W

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

BGX50AE6327XT Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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