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BGX50AE6327

Infineon Technologies

BGX50AE6327 by Infineon Technologies

BGX50AE6327 by Infineon Technologies is a bridge rectifier diode with 4 elements, made of silicon. It has a max output current of 0.14A and can operate at temperatures up to 150°C. This small outline package with gull wing terminals is suitable for various electronic applications requiring rectification of AC to DC voltage.

Median Price

$0.440

Lifecycle Status

EOL

Suppliers In-Stock

24

In-Stock Inventory

1k+

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Mouser Electronics

USA . 19,086 parts In-Stock

1+ parts

$0.440

100+ parts

$0.207

1k+ parts

$0.112

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$0.084

19,086

$0.440

$0.207

$0.112

$0.084

Adafruit Industries

USA . 30 parts In-Stock

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DF Sales Co.

USA . 80 parts In-Stock

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$0.113

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$0.113

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DF Sales Co.

USA . 80 parts In-Stock

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$0.113

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Digiode

USA . 800 parts In-Stock

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ComSIT Distribution GmbH

Germany . 33,435 parts In-Stock

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VNN

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Vyrian

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Prism Electronics

USA . 6,956 parts In-Stock

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Dan-Mar Components

USA . 5,569 parts In-Stock

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Sinequanon

UK . 3,300 parts In-Stock

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TME

Poland . 2,261 parts In-Stock

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$0.210

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$0.161

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$0.147

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QIE Inc.

USA . 2,250 parts In-Stock

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

France . 1,174 parts In-Stock

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First Choice Components Inc.

USA . 465 parts In-Stock

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465

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Q Components

USA . 340 parts In-Stock

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North Shore Components

USA . 125 parts In-Stock

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Sunrise Surplus Inc.

USA . 91 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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EMSNET

USA . 20 parts In-Stock

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Bristol Electronics

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PC Components Company LLC

USA . 6 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 25,876 parts In-Stock

1+ parts

$0.016

100+ parts

$0.015

1k+ parts

$0.015

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25,876

$0.016

$0.015

$0.015

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Corohmni

South Africa . 559 parts In-Stock

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$0.150

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$0.150

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Semicontronic

India . 29,751 parts In-Stock

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$0.374

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$0.365

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$0.363

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Ampacity Inc.

Singapore . 16,358 parts In-Stock

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$0.374

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Corphita

USA . 892 parts In-Stock

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$0.396

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Andel Nordic

Denmark . 656 parts In-Stock

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$15.050

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$10.535

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$10.535

656

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$10.535

Kepictronics

USA . 33,000 parts In-Stock

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Metaverse IC Inc.

Canada . 33,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 13,074 parts In-Stock

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Perfect Parts

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Lixinc

USA . 5,065 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4,905 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,049 parts In-Stock

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Assy Fe

Spain . 2,800 parts In-Stock

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Argo Parts USA

USA . 2,687 parts In-Stock

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GreenTree Electronics

Israel . 2,551 parts In-Stock

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Authorized Procurement Solutions

USA . 2,551 parts In-Stock

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Continental Prestige Electronics

USA . 1,253 parts In-Stock

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Infinite Electronics LLP (Excess)

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Bastille Electronics

Australia . 900 parts In-Stock

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Formix International (Excess)

India . 73 parts In-Stock

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Advanced Electronics

New Zealand . 38 parts In-Stock

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Overview

Unlock the power of efficiency and reliability with the BGX50AE6327 by Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and performance in their Bridge Rectifier Diodes. Perfect for a wide range of applications, this product offers customers exceptional value, benefits, and advantages. Experience seamless integration, enhanced functionality, and peace of mind knowing you have a superior product at your disposal. Choose the BGX50AE6327 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the diodes, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability makes it easy to integrate the bridge rectifier diodes onto a PCB, saving space and simplifying assembly.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, these diodes can withstand harsh environments and high temperatures.

Maximum Power Dissipation: 0.21 W

The low power dissipation of 0.21W indicates efficient energy conversion and minimal heat generation during operation.

Maximum Output Current: 0.14 A

The maximum output current of 0.14A is suitable for various applications requiring modest current levels.

Diode Element Material: SILICON

Silicon diode elements offer reliable and consistent performance in rectifying AC signals to DC, making them a popular choice for bridge rectifiers.

Technical Specifications

Bridge Rectifier Diodes BGX50AE6327 attributes and parameters. Explore more Bridge Rectifier Diodes devices from Infineon Technologies

Specs

Case Connection:

CATHODE

Config:

BRIDGE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

4

No. of Phases:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.14 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.21 W

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

BGX50AE6327 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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