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BCR421UE6327XT

Infineon Technologies

BCR421UE6327XT by Infineon Technologies

BCR421UE6327XT by Infineon Technologies is a Graphics Display Driver with 6 terminals, AEC-Q100 screening level, and max supply voltage of 40V. It is a surface-mount LED display driver in small outline package suitable for automotive applications.

Median Price

$0.140

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 18,000 parts In-Stock

1+ parts

-

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$0.140

18,000

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-

$0.140

Distributors (In-Stock)

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Vyrian

USA . 10,483 parts In-Stock

1+ parts

-

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10,483

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VNN

France . 798 parts In-Stock

1+ parts

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798

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

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-

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700

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Digiode

USA . 275 parts In-Stock

1+ parts

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275

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 10,368 parts In-Stock

1+ parts

$0.119

100+ parts

$0.116

1k+ parts

$0.115

10k+ parts

-

10,368

$0.119

$0.116

$0.115

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Ampacity Inc.

Singapore . 10,211 parts In-Stock

1+ parts

$0.119

100+ parts

-

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10,211

$0.119

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Aztec Data Supply Inc.

USA . 887 parts In-Stock

1+ parts

$8.860

100+ parts

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887

$8.860

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Corohmni

South Africa . 91 parts In-Stock

1+ parts

$11.409

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91

$11.409

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Modulus Dynamics

Lithuania . 1,973 parts In-Stock

1+ parts

$14.709

100+ parts

$14.121

1k+ parts

$13.532

10k+ parts

-

1,973

$14.709

$14.121

$13.532

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Corphita

USA . 978 parts In-Stock

1+ parts

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978

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Argo Parts USA

USA . 738 parts In-Stock

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738

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Continental Prestige Electronics

USA . 306 parts In-Stock

1+ parts

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306

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Enhance your visual experience with the BCR421UE6327XT from Infineon Technologies, a leading manufacturer known for top-quality products. This graphics display driver offers seamless integration and reliable performance, making it ideal for a wide range of applications. With a maximum supply voltage of 40V and AEC-Q100 screening level, this product ensures durability and efficiency. Elevate your projects with the compact design and advanced features of this LED display driver. Experience the value and benefits that this cutting-edge technology brings to your display solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to impact, making this product suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 40 V

With a high maximum supply voltage of 40V, this display driver can handle a wide range of power inputs, providing flexibility in design.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, making this product suitable for automotive applications where ruggedness is essential.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB, making it ideal for compact designs.

No. of Terminals: 6

Having 6 terminals provides sufficient connection points for interfacing with other components, enabling versatile use in various systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style helps in reducing the overall footprint of the display driver, making it suitable for space-constrained applications.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved connectivity, increasing the reliability of the product in demanding environments.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a slim profile, enabling the display driver to be used in thin devices or applications with height restrictions.

Width: 1.6 mm

The narrow width of 1.6mm contributes to the compactness of the overall design, making it suitable for applications with limited space.

Length: 2.9 mm

The short length of 2.9mm helps in further minimizing the space taken up by the display driver, especially in applications where size is a critical factor.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical robustness and ease of soldering during assembly, ensuring a reliable and secure connection.

No. of Segments: 2

Having 2 segments allows for multiple display functions or the ability to control different parts of a display independently, enhancing the versatility of the product.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95mm facilitates high-density mounting on the PCB, enabling a compact layout and efficient use of space.

Interface IC Type: LED DISPLAY DRIVER

The LED display driver interface IC type ensures compatibility and optimized performance for driving LED displays, making it a suitable choice for display applications requiring high brightness and energy efficiency.

Technical Specifications

Graphics Display Drivers BCR421UE6327XT attributes and parameters. Explore more Graphics Display Drivers devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Functions:

1

No. of Segments:

2

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

40 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

BCR421UE6327XT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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