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BAT62-07W-E6327

Infineon Technologies

BAT62-07W-E6327 by Infineon Technologies

Infineon's BAT62-07W-E6327 diode has a max reverse current of 10uA, VF of 1V, and operates b/w -55 to 150 °C. Ideal for surface mount applications, it offers a peak reverse voltage of 40V making it suitable for various electronic circuits.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 5,590 parts In-Stock

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$0.770

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$0.580

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$0.500

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5,590

$0.770

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VNN

France . 3,420 parts In-Stock

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Zilex Electronics Inc.

Canada . 3,000 parts In-Stock

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J2 Sourcing AB

Sweden . 2,253 parts In-Stock

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Vyrian

USA . 1,538 parts In-Stock

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Digiode

USA . 624 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 360 parts In-Stock

1+ parts

$0.010

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360

$0.010

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

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$0.090

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300

$0.090

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Modulus Dynamics

Lithuania . 21,990 parts In-Stock

1+ parts

$0.152

100+ parts

$0.146

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$0.140

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21,990

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AZTECH Wire

Italy . 294 parts In-Stock

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$10.145

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Andel Nordic

Denmark . 5,087 parts In-Stock

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$34.580

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$24.208

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5,087

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$24.208

Argo Parts USA

USA . 4,173 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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Corphita

USA . 575 parts In-Stock

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Kepictronics

USA . 400 parts In-Stock

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Continental Prestige Electronics

USA . 237 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock new possibilities with the BAT62-07W-E6327 by Infineon Technologies. Known for their superior quality and innovation, Infineon Technologies delivers cutting-edge solutions in the Other Function Diodes category. This surface-mount diode offers a maximum reverse current of 10 uA and a peak reflow temperature of 260°C, making it ideal for a wide range of applications. Experience reliable performance and efficiency with the BAT62-07W-E6327, providing unmatched value and benefits to customers looking for top-of-the-line electronic components.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability makes it easy to integrate into PCBs, saving space and simplifying the assembly process.

Maximum Reverse Current: 10 uA

The low maximum reverse current allows for efficient energy management and helps in reducing power consumption.

Reverse Test Voltage: 40 V

The high reverse test voltage provides protection against reverse voltage spikes and ensures the reliability of the diode.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for use in a wide range of environments and applications without the risk of overheating.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the diode can function even in extremely cold conditions, making it versatile for various industries.

Maximum Power Dissipation: 0.1 W

The low power dissipation helps in reducing heat generation and improves the overall efficiency of the diode.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during the assembly process, ensuring a strong and durable connection.

Maximum Forward Voltage (VF): 1 V

The low maximum forward voltage drop ensures minimal power loss across the diode, making it energy efficient.

Maximum Repetitive Peak Reverse Voltage: 40 V

The high repetitive peak reverse voltage rating ensures the diode can withstand reverse voltage spikes over an extended period, increasing the longevity of the product.

Technical Specifications

Other Function Diodes BAT62-07W-E6327 attributes and parameters. Explore more Other Function Diodes devices from Infineon Technologies

Specs

Maximum Forward Voltage (VF):

1 V

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.1 W

Maximum Repetitive Peak Reverse Voltage:

40 V

Maximum Reverse Current:

10 uA

Reverse Test Voltage:

40 V

Sub-Category:

Other Diodes

Surface Mount:

YES

Trade Compliance

BAT62-07W-E6327 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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