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MBM27C512-20Z

Fujitsu Semiconductor America

MBM27C512-20Z by Fujitsu Semiconductor America

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

EPROM MBM27C512-20Z attributes and parameters. Explore more EPROM devices from Fujitsu Semiconductor America

Specs

Maximum Access Time:

200 ns

JESD-30 Code:

R-GDIP-T28

Length:

37.275 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.84 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

MBM27C512-20Z Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Fujitsu Semiconductor America

Fujitsu Semiconductor America, Inc. leads the industry in innovation. Specifically, Fujitsu provides high-quality, reliable semiconductor products and services for the wireless, automotive, consumer, industrial, communications, and other markets throughout North and South America.

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