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MCF5282CVF66J

Freescale Semiconductor

MCF5282CVF66J by Freescale Semiconductor

MCF5282CVF66J by Freescale Semiconductor is a 32-bit microcontroller with 524288 ROM words and 65536 RAM bytes. It operates at a speed of 66 rpm and is commonly used in industrial applications.

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Overview

Discover the MCF5282CVF66J microcontroller by Freescale Semiconductor, a cutting-edge solution that brings top-notch quality and unrivaled performance to your projects. As a leader in the industry, Freescale Semiconductor is renowned for its innovative technology and dedication to customer satisfaction. The MCF5282CVF66J offers numerous benefits and advantages, making it the perfect choice for a wide range of applications. With an impressive 32-bit size and powerful ColdFire CPU family, this microcontroller delivers unmatched speed and efficiency. Its compact package body material ensures durability and reliability, while the surface mount feature allows for easy installation. Whether you're working on industrial or consumer electronics, the MCF5282CVF66J exceeds expectations with its exceptional ROM programmability, ample RAM capacity, and precise temperature control. Embrace the future of microcontrollers and unleash your creativity with the MCF5282CVF66J – the ultimate tool for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and lightweight design, making it suitable for portable devices.

Surface Mount: YES

With surface mount capability, the microcontroller can be easily incorporated into compact circuit designs, enabling space optimization in electronic devices.

Package Shape: SQUARE

The square shape allows for efficient utilization of space on PCBs, enabling better integration and more flexibility in product design.

Bit Size: 32

The microcontroller's 32-bit architecture provides enhanced processing capabilities, making it suitable for applications requiring complex computations and data processing.

Power Supplies (V): 3/3.3

The wide range of compatible power supply voltages ensures compatibility with a variety of systems, reducing the need for additional components and simplifying integration.

No. of Terminals: 256

With a large number of terminals, the microcontroller offers extensive connectivity options, enabling seamless interfacing with various external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved electrical performance and thermal dissipation, making it a reliable choice for applications requiring efficient heat management.

Maximum Operating Temperature: 85 °C

The microcontroller's high maximum operating temperature allows it to withstand harsh environmental conditions, ensuring reliability and longevity in demanding applications.

CPU Family: COLDFIRE

Built on the ColdFire architecture, the microcontroller provides excellent performance and exceptional power efficiency, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The microcontroller's low minimum operating temperature capability allows it to function reliably in extreme cold environments, expanding its potential use in various industries and climates.

Terminal Finish: TIN LEAD SILVER

The use of tin lead silver finish on the terminals ensures excellent solderability and corrosion resistance, promoting reliable connections and long-term device functionality.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy integration into PCB layouts, simplifying the manufacturing process and reducing assembly complexities.

ROM Words: 524288

With a large ROM capacity, the microcontroller can store a significant amount of program code, enabling the implementation of complex functionalities and providing versatility for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller's ability to withstand peak reflow temperatures for extended durations allows for reliable soldering during assembly, minimizing the risk of solder joint defects.

Peak Reflow Temperature °C: 220

The high peak reflow temperature capability ensures proper solder melting and bonding during manufacturing processes, improving the overall reliability and integrity of the device.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the microcontroller meets or exceeds the stringent temperature requirements and reliability standards demanded by challenging environments.

RAM Bytes: 65536

The microcontroller's generous RAM capacity provides ample memory space for temporary data storage, allowing for efficient multitasking and smooth operation of applications.

Technology: CMOS

Utilizing CMOS technology, the microcontroller offers low power consumption, fast switching speeds, and improved noise immunity, making it ideal for battery-powered and noise-sensitive applications.

Terminal Form: BALL

The use of ball terminal form enhances ease of assembly and improves electrical conductivity, ensuring reliable and efficient electrical connections.

Maximum Supply Current: 200 mA

The microcontroller's maximum supply current of 200 mA offers sufficient power for various components and peripherals, allowing for seamless integration and operation of the system.

ROM Programmability: FLASH

The flash programmability of the microcontroller enables easy firmware/software updates and modifications, enhancing flexibility and adaptability to changing application requirements.

Terminal Pitch: 1 mm

With a compact terminal pitch of 1 mm, the microcontroller optimizes PCB space utilization, enabling the design of smaller and more compact electronic devices.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper handling and storage procedures, minimizing the risk of moisture-related issues during manufacturing and prolonging the product's lifespan.

Speed: 66 rpm

The microcontroller's speed of 66 rpm allows for fast and efficient data processing, enabling real-time response and smooth operation in time-critical applications.

Technical Specifications

Microcontrollers MCF5282CVF66J attributes and parameters. Explore more Microcontrollers devices from Freescale Semiconductor

Specs

Bit Size:

32

CPU Family:

COLDFIRE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

200 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MCF5282CVF66J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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