Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF/MICROWAVE TERMINATION; Construction: COMPONENT; Maximum Voltage Standing Wave Ratio: 1.35; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 4000 MHz;
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RF/Microwave Terminations 32-1006 attributes and parameters. Explore more RF/Microwave Terminations devices from Florida Rf Labs
Characteristic Impedance:
Construction:
Maximum Input Power (CW):
Maximum Operating Frequency:
Minimum Operating Frequency:
RF or Microwave Device Type:
Maximum Voltage Standing Wave Ratio:
EMC Technology & Florida RF Labs, a Smiths Interconnect business, is an internationally recognized leader in the development and manufacturing of thin and thick film RF and Microwave resistive components, signal distribution products, and cable assemblies. We support customers in the Telecommunications, Military, Broadcast Equipment, Space, Aerospace, Medical Equipment and Test & Measurement markets. Our products include fixed and Thermopad® temperature variable attenuators, terminations, RF resistors, HybriX® 3dB hybrid and directional couplers, RF/MW cable assemblies, Smart Detector temperature sensing terminations, and hybrid specialties. Note: EMC Technology & Florida RF Labs have been acquired by Smiths Interconnect.
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
CRCW080510R0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510R0FKEA is a fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V. Operating temperature range from -55 to 155 °C ensures reliability in various environments.
STM32H753IIK6
STMicroelectronics
STM32H753IIK6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like CAN, ETHERNET, and USB. Ideal for industrial applications requiring high-speed processing and extensive connectivity options.
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
Sangdest Microelectronics (Nanjing)
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
General Semiconductor
Wuxi Xuyang Electronic
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H743ZIT6
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
TM4C1294NCPDTI3
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
RFP-60-50TPC
Anaren
Anaren's RFP-60-50TPC RF/Microwave Termination handles up to 47.78 dBm CW power with VSWR of 1.25, ideal for frequencies from 0-6000 MHz. Its module construction and silver terminal finish ensure reliable performance in temperatures ranging from -55 to 150°C.
C8A50Z4B
Ttm Technologies
C8A50Z4B by Ttm Technologies is an RF/Microwave Termination with a max input power of 39.03 dBm and operating frequency range from 0-6000 MHz. It has a characteristic impedance of 50 ohm, matte tin over nickel terminal finish, and can operate in temperatures ranging from -55 to 125 °C. Ideal for high-power RF applications requiring precise impedance matching.
RFP-250-50TC
RFP-250-50TC by Ttm Technologies is an RF/Microwave Termination with 53.98 dBm CW power, 1.3 VSWR, and 50 ohm impedance. Ideal for applications requiring a wide operating frequency range of 0-3000 MHz in environments ranging from -55 to 150°C.
CT1005
Smiths Group Plc
CT1005 by Smiths Group Plc is an RF/Microwave Termination with 41.76 dBm CW power, 1.25 VSWR, and 50 ohm impedance. It operates from -55 to 125 °C, suitable for applications requiring high power handling and precise signal termination in the frequency range of 0-4000 MHz.
32-1045
Emc Technology & Florida Rf Labs
RF/MICROWAVE TERMINATION; Terminal Finish: GOLD; Maximum Operating Temperature: 150 Cel; Maximum Voltage Standing Wave Ratio: 1.25; Maximum Operating Frequency: 6400 MHz; Construction: MODULE;
FT10302N0050JBK
American Technical Ceramics
RF/MICROWAVE TERMINATION; Maximum Voltage Standing Wave Ratio: 1.25; Minimum Operating Frequency: 0 MHz; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; JESD-609 Code: e4;
8234
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 18000 MHz; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 0 MHz; Minimum Operating Temperature: -55 Cel; Maximum Input Power (CW): 30 dBm;
3008
Api Technologies
RF/MICROWAVE TERMINATION; JESD-609 Code: e4; Maximum Operating Frequency: 1000 MHz; Additional Features: SMA-F; SMA-M; Maximum Input Power (CW): 33.01 dBm; Terminal Finish: GOLD;
8464
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 18000 MHz; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Minimum Operating Frequency: 0 MHz; Minimum Operating Temperature: -55 Cel;
8461
RF/MICROWAVE TERMINATION; Construction: MODULE; Maximum Operating Frequency: 18000 MHz; Maximum Operating Temperature: 150 Cel; Characteristic Impedance: 50 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
3018
Aeroflex/inmet
RF/MICROWAVE TERMINATION; Maximum Operating Temperature: 125 Cel; Maximum Input Power (CW): 33.01 dBm; Maximum Voltage Standing Wave Ratio: 1.3; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 0 MHz;
8435
RF/MICROWAVE TERMINATION; Maximum Operating Temperature: 150 Cel; Maximum Input Power (CW): 30 dBm; Maximum Operating Frequency: 18000 MHz; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Voltage Standing Wave Ratio: 1.3;
8463
RF/MICROWAVE TERMINATION; Additional Features: I/P POWER-MAX(PEAK)=100W; Maximum Voltage Standing Wave Ratio: 1.3; Construction: MODULE; Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 30 dBm;
42-1072
Smiths Group Plc's 42-1072 RF/Microwave Termination handles up to 43.01 dBm CW power with a VSWR of 1.3, covering 0-2000 MHz range. Ideal for RF applications requiring a 50 ohm impedance, this MODULE construction device ensures efficient signal termination and reflection suppression.
FT10301N0050JBK
KYOCERA AVX
FT10301N0050JBK by KYOCERA AVX is a RF/Microwave Termination with 50 ohm impedance, 1.25 VSWR, and 43.01 dBm CW power handling. Ideal for applications requiring termination of signals in the frequency range of 0-6000 MHz with operating temperatures from -55 to 150°C.
5325
5325 by Smiths Group Plc is an RF/Microwave Termination with 43.98 dBm CW power, 1.35 VSWR, and 50 ohm impedance. Ideal for applications requiring a module construction, operating b/w -55 to 150 °C in the frequency range of 0-2000 MHz.
PST-1
PST-1 by Api Technologies is an RF/Microwave Termination module with 30 dBm CW power, 1.5 VSWR, and 50 ohm impedance. It operates from -55°C to 150°C and covers frequencies from 0 MHz to 18 GHz. Ideal for applications requiring high-power termination in RF/microwave systems.
42-1045
Smiths Group Plc's 42-1045 RF/Microwave Termination handles up to 34.77 dBm CW power with a VSWR of 1.25. Operating from 0-18000 MHz, it has a 50 ohm impedance and is ideal for RF/Microwave applications due to its high power handling and wide frequency range.
M39030/3-11N
Vertiv
RF/MICROWAVE TERMINATION; Maximum Input Power (CW): 33.01 dBm; Construction: COAXIAL; Minimum Operating Frequency: 0 MHz; Additional Features: SMA-M; Maximum Operating Frequency: 18000 MHz;
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 18000 MHz; Characteristic Impedance: 50 ohm; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Input Power (CW): 30 dBm; Additional Features: I/P POWER-MAX(PEAK)=100W;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
32-1045 by Smiths Group Plc is an RF/Microwave Termination with a max input power of 40 dBm, VSWR of 1.25, and operating frequency range from 0-6400 MHz. It is designed for applications requiring termination of RF/microwave signals in modules, featuring a gold terminal finish and a temperature range from -55 to 150°C.
32-1006
RF/MICROWAVE TERMINATION; Maximum Operating Temperature: 150 Cel; Minimum Operating Frequency: 0 MHz; Construction: MODULE; Maximum Operating Frequency: 4000 MHz; Minimum Operating Temperature: -55 Cel;
RF/MICROWAVE TERMINATION; JESD-609 Code: e0; Minimum Operating Frequency: 0 MHz; Maximum Operating Temperature: 150 Cel; Maximum Operating Frequency: 4000 MHz; Maximum Voltage Standing Wave Ratio: 1.35;
32-1017
RF/MICROWAVE TERMINATION; JESD-609 Code: e4; Maximum Voltage Standing Wave Ratio: 1.2; Terminal Finish: GOLD; Maximum Input Power (CW): 56.02 dBm; Minimum Operating Temperature: -55 Cel;
RF/MICROWAVE TERMINATION; Maximum Operating Temperature: 125 Cel; Maximum Input Power (CW): 56.02 dBm; Construction: MODULE; JESD-609 Code: e4; Terminal Finish: GOLD;
Florida Rf Labs
RF/MICROWAVE TERMINATION; JESD-609 Code: e4; Maximum Operating Temperature: 125 Cel; Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 56.02 dBm; Maximum Voltage Standing Wave Ratio: 1.2;
32-1008
RF/MICROWAVE TERMINATION; Maximum Voltage Standing Wave Ratio: 1.35; Maximum Operating Temperature: 150 Cel; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 0 MHz; Maximum Input Power (CW): 40 dBm;
32-1069
RF/MICROWAVE TERMINATION; Construction: MODULE; Characteristic Impedance: 50 ohm; Maximum Voltage Standing Wave Ratio: 1.35; Maximum Input Power (CW): 40 dBm; Minimum Operating Temperature: -55 Cel;
32-1026
RF/MICROWAVE TERMINATION; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 150 Cel; Maximum Operating Frequency: 4000 MHz; Terminal Finish: TIN LEAD; Construction: MODULE;
32-1001
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Maximum Input Power (CW): 43.01 dBm; Characteristic Impedance: 50 ohm; Construction: COMPONENT; Maximum Voltage Standing Wave Ratio: 1.35;
32-1003
RF/MICROWAVE TERMINATION; Construction: COMPONENT; Minimum Operating Frequency: 0 MHz; Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 51.76 dBm; Maximum Voltage Standing Wave Ratio: 1.35;
32-1004
RF/MICROWAVE TERMINATION; Construction: COMPONENT; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 0 MHz; Maximum Input Power (CW): 53.98 dBm; Maximum Voltage Standing Wave Ratio: 1.35;
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 4000 MHz; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 0 MHz; Maximum Voltage Standing Wave Ratio: 1.35; Construction: COMPONENT;
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; JESD-609 Code: e4; Terminal Finish: Silver (Ag); Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 51.76 dBm;
32-1034
RF/MICROWAVE TERMINATION; Maximum Input Power (CW): 44.77 dBm; Maximum Voltage Standing Wave Ratio: 1.25; Construction: COMPONENT; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 4000 MHz;
32-1051
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 4000 MHz; Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 44.77 dBm; Maximum Voltage Standing Wave Ratio: 1.25;
RF/MICROWAVE TERMINATION; Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 40 dBm; Maximum Voltage Standing Wave Ratio: 1.4; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 10000 MHz;
RF/MICROWAVE TERMINATION; Maximum Voltage Standing Wave Ratio: 1.35; Maximum Input Power (CW): 40 dBm; Construction: MODULE; JESD-609 Code: e0; Minimum Operating Frequency: 0 MHz;
32-1041
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 4000 MHz; Maximum Input Power (CW): 40 dBm; Maximum Voltage Standing Wave Ratio: 1.35; Characteristic Impedance: 50 ohm;
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