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MR25H128AMDF

Everspin Technologies

MR25H128AMDF by Everspin Technologies

EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words: 16384 words;

Median Price

$7.100

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Mouser Electronics

USA . 171 parts In-Stock

1+ parts

$15.630

100+ parts

$13.400

1k+ parts

$12.640

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$15.630

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$12.640

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Verical

USA . 4,530 parts In-Stock

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$7.100

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$7.100

EBV Elektronik

Germany . 1,710 parts In-Stock

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1,710

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Avnet

USA . 1,710 parts In-Stock

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Future Electronics

Canada . 1,140 parts In-Stock

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$7.070

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Distributors (In-Stock)

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IBS Electronics

USA . 2,280 parts In-Stock

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$9.898

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NAC Semi

USA . 1,140 parts In-Stock

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$14.140

10k+ parts

$13.050

1,140

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$14.140

$13.050

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Kepictronics

USA . 520 parts In-Stock

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Technical Specifications

EEPROM MR25H128AMDF attributes and parameters. Explore more EEPROM devices from Everspin Technologies

Specs

Maximum Clock Frequency (fCLK):

40 MHz

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Serial Bus Type:

SPI

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5 mm

Trade Compliance

MR25H128AMDF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Everspin Technologies

Everspin Technologies, Inc. Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-transfer Torque MRAM (STT-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 120 Million MRAM and STT-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. Core Competence with MRAM: From Perpendicular to Field-Switched Everspin’s knowledge and experience in magnetic memory design, manufacture and delivery into relevant applications is unique within the semiconductor industry. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. Manufacturing - The Capacity to Deliver In 2014, Everspin partnered with GLOBALFOUNDRIES for full turn-key 300mm high-volume production of in-plane and perpendicular MTJ ST-MRAM on advanced technology nodes including 40nm, 28nm and beyond. In addition, Everspin owns and operates an integrated magnetic fabrication line located in Chandler, Arizona, where Everspin produces MRAM products are based on 180nm, 130nm, and 90nm process technology nodes. Product package and test operations are located in China, Taiwan and other Asian countries.

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