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BYD17M

Eic Semiconductor

BYD17M by Eic Semiconductor

RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;

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VNN

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LWI Electronics Inc

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LIBRA Elektronik GmbH

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ComSIT Distribution GmbH

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Digiode

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Pegasus Components GmbH

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ACDS - Activité Composants Distribution Service

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Cyclops Electronics Ltd

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Legend Electronics Inc.

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LittleDiode

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Semi Source

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Fibra_Brandt Electronic GMBH

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Corphita

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GreenTree Electronics

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Technical Specifications

Diodes & Rectifiers BYD17M attributes and parameters. Explore more Diodes & Rectifiers devices from Eic Semiconductor

Specs

Additional Features:

LOW LEAKAGE CURRENT

Application:

GENERAL PURPOSE

Minimum Breakdown Voltage:

1100 V

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.05 V

JESD-30 Code:

O-PELF-R2

Maximum Non Repetitive Peak Forward Current:

20 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-65 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

LONG FORM

Maximum Repetitive Peak Reverse Voltage:

1000 V

Maximum Reverse Current:

1 uA

Maximum Reverse Recovery Time:

3 us

Reverse Test Voltage:

1000 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

END

Trade Compliance

BYD17M Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Eic Semiconductor

EIC is a major international manufacturer and supplier of discrete semiconductors. With over 15,000 parts and more than 50 package types, EIC offers one of the most comprehensive diode portfolios in the industry. The company’s products can be classified into five main categories: • Rectifier Diodes • High Speed Switching / Small Signal Diodes • Zener Diodes • Transient Voltage Suppressor Diodes • Transistors EIC provides end to end manufacturing with a dedicated wafer fab and assembly plant to ensure control of quality and supply. Expansion of the wafer fab during 2007 has provided EIC with the ability to supply products in die and wafer form, in addition to packaged parts. EIC provides its customers with world-class service and technical support, as well as high quality products at competitive prices. The company’s processes and procedures, from design to after sales service, are fully ISO 9001, ISO14001 and ISO/TS16949 certified, and all products are RoHs compliant. With sales offices worldwide, and a reliable logistics process, EIC is able to offer customers quick responses to both technical enquiries and product delivery. The EIC Engineering team is focused on developing superior discrete products to satisfy the variety of requirements from new customer systems. The company also offers an extensive capability for research and development of special purpose devices, to satisfy unique customer applications. These are achieved with close attention to cost reduction and fast time to market.

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