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ZVN2110GTC

Diodes Incorporated

ZVN2110GTC by Diodes Incorporated

ZVN2110GTC by Diodes Incorporated is a N-CHANNEL FET for SWITCHING applications. Features 100V DS Breakdown Voltage, 6A IDM, and 4Ω RDS(ON). Ideal for ENHANCEMENT MODE operation in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

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450

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Vyrian

USA . 444 parts In-Stock

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444

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Distributors (Availability)

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Semicontronic

India . 1,097 parts In-Stock

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$0.050

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$0.049

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$0.048

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1,097

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Corohmni

South Africa . 64 parts In-Stock

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$0.322

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64

$0.322

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Aztec Data Supply Inc.

USA . 1,988 parts In-Stock

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$1.530

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$1.530

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AZTECH Wire

Italy . 579 parts In-Stock

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$15.255

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579

$15.255

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Kepictronics

USA . 10,087 parts In-Stock

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Continental Prestige Electronics

USA . 5,180 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Argo Parts USA

USA . 2,436 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Unlock the power of innovation with the ZVN2110GTC by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a focus on performance and reliability, this N-CHANNEL transistor offers enhanced mode operation, high breakdown voltage, and low on-resistance. Whether you're designing consumer electronics or industrial equipment, the ZVN2110GTC provides exceptional value, efficiency, and precision in every use. Elevate your projects with the cutting-edge technology of Diodes Incorporated.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have higher mobility and speed compared to P-Channel transistors, making this transistor suitable for high-performance applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to use in various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance and reliability in switching circuits.

Surface Mount: YES

Surface mount capability allows for easy and efficient pcb assembly, saving time and effort during manufacturing.

Minimum DS Breakdown Voltage: 100 V

High breakdown voltage ensures safe operation in high voltage circuits, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular shape enables easy placement and mounting in standardized pcb layouts, improving overall design efficiency.

Terminal Form: GULL WING

Gull wing terminals are suitable for surface mount applications, providing secure and reliable connection points.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and efficiency in switching operations, making this transistor a reliable choice for power management.

Maximum Pulsed Drain Current (IDM): 6 A

High pulsed drain current capability allows for handling sudden spikes in current, ideal for applications with varying load requirements.

No. of Terminals: 4

4 terminals provide necessary connections for power and control signals, facilitating easy integration into circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact and densely populated designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, ensuring consistent operation in various conditions.

Transistor Element Material: SILICON

Silicon material provides high carrier mobility and thermal stability, making this transistor suitable for demanding applications.

Maximum Drain Current (ID): 0.5 A

With a maximum drain current of 0.5 A, this transistor is ideal for low to medium power applications where efficiency is key.

Maximum Drain-Source On Resistance: 4 ohm

Low on-resistance ensures minimal power loss and heat generation, making this transistor efficient for power management applications.

Terminal Position: DUAL

Dual terminal position allows for flexible pcb layout and connectivity options, enhancing the usability of this transistor in various designs.

Case Connection: DRAIN

Drain connection simplifies the circuit design and provides easy access for connecting external components, enhancing versatility in application use.

Technical Specifications

Power Field Effect Transistors (FET) ZVN2110GTC attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

FAST SWITCHING

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

.5 A

Maximum Drain-Source On Resistance:

4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

6 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

ZVN2110GTC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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