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PI3VDP411LSZBEX

Diodes Incorporated

PI3VDP411LSZBEX by Diodes Incorporated

PI3VDP411LSZBEX by Diodes Inc. is a 48-terminal consumer IC with a power supply of 3.3V, suitable for industrial applications. It operates b/w -40 to 85°C and has a max supply current of 100mA. This square-shaped chip carrier with a very thin profile is surface-mountable and ideal for consumer circuit designs.

Median Price

$0.639

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 3,000 parts In-Stock

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Mouser Electronics

USA . 2,048 parts In-Stock

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$0.639

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DF Sales Co.

USA . 28 parts In-Stock

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$0.900

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DF Sales Co.

USA . 28 parts In-Stock

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$0.900

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Chip Stock

USA . 2,827 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 403 parts In-Stock

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Dan-Mar Components

USA . 362 parts In-Stock

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Bristol Electronics

USA . 343 parts In-Stock

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Microchip USA

USA . 2,901 parts In-Stock

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$4.504

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Metaverse IC Inc.

Canada . 70,000 parts In-Stock

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Lixinc

USA . 15,906 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,634 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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iodParts Technologies Inc.

India . 1,968 parts In-Stock

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Perfect Parts

USA . 112 parts In-Stock

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Kepictronics

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Overview

Enhance your consumer electronics with the PI3VDP411LSZBEX by Diodes Incorporated. Known for their superior quality and innovative technology, Diodes Incorporated has created a cutting-edge product that offers unmatched performance and reliability. Ideal for a wide range of applications in the consumer electronics industry, this product provides customers with exceptional value, efficiency, and functionality. Say goodbye to outdated technology and elevate your devices with the PI3VDP411LSZBEX.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and efficient PCB assembly, saving time and reducing the chances of manual errors.

Package Shape: SQUARE

The square shape is compact and allows for efficient use of space on the PCB.

Power Supplies (V): 3.3

This voltage is commonly used in consumer electronics, making it compatible with a wide range of devices.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and functionality in the circuit.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes this product suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures that the product can operate in a variety of environmental conditions.

Maximum Seated Height: 1 mm

The low seated height allows for a slim profile and compact design, making it ideal for space-constrained applications.

Maximum Supply Current: 100 mA

This product has a relatively low supply current, making it energy-efficient and suitable for battery-powered devices.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting of components on the PCB, saving space and reducing overall size.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources and devices.

Technical Specifications

Other Function Consumer ICs PI3VDP411LSZBEX attributes and parameters. Explore more Other Function Consumer ICs devices from Diodes Incorporated

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

PI3VDP411LSZBEX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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