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PI2EQX5904NJEX

Diodes Incorporated

PI2EQX5904NJEX by Diodes Incorporated

Diodes Inc. PI2EQX5904NJEX is a 100-terminal interface IC with max supply voltage of 1.25V and max current of 800mA. It's used in industrial applications, featuring a low-profile grid array package shape for compact designs and operating temperature range from -40 to 85°C.

Median Price

$15.380

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 25 parts In-Stock

1+ parts

$15.380

100+ parts

-

1k+ parts

$9.739

10k+ parts

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25

$15.380

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$9.739

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 6,970 parts In-Stock

1+ parts

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6,970

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Vyrian

USA . 235 parts In-Stock

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235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 100 parts In-Stock

1+ parts

$8.996

100+ parts

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1k+ parts

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100

$8.996

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AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$14.365

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223

$14.365

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Microchip USA

USA . 438 parts In-Stock

1+ parts

$27.270

100+ parts

$26.880

1k+ parts

$26.680

10k+ parts

$26.490

438

$27.270

$26.880

$26.680

$26.490

Lixinc

USA . 7,298 parts In-Stock

1+ parts

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7,298

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Argo Parts USA

USA . 1,682 parts In-Stock

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1,682

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Continental Prestige Electronics

USA . 807 parts In-Stock

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807

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Enhance your electronic systems with the PI2EQX5904NJEX by Diodes Incorporated. Known for their top-quality products, Diodes Incorporated has crafted this interface circuit with precision and expertise. Designed for a wide range of applications, this square-shaped IC boasts a low profile package style and a grid array layout. With a nominal supply voltage of 1.2V and a maximum seated height of just 1.7mm, this product offers exceptional value and performance to customers looking to optimize their systems. Upgrade your electronics with the PI2EQX5904NJEX today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Lightweight and durable material, suitable for various applications.

Surface Mount:

YES - Easy to install and saves space on the PCB.

Maximum Supply Voltage:

1.25 V - Provides reliable power to the IC without risk of damage.

Package Shape:

SQUARE - Compact shape that can fit into tight spaces.

Power Supplies (V):

1.2 - Consistent power supply for stable operation.

No. of Terminals:

100 - Sufficient number of terminals for multiple connections.

Package Style (Meter):

GRID ARRAY, LOW PROFILE - Space-saving design with efficient heat dissipation.

Minimum Supply Voltage:

1.15 V - Ensures proper functionality even at lower voltage levels.

Maximum Operating Temperature:

85 °C - Can operate in high-temperature environments without issues.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme cold conditions.

Terminal Position:

BOTTOM - Easy access to terminals for quick connection.

Maximum Seated Height:

1.7 mm - Low profile design for slim devices.

Width:

11 mm - Compact width for fitting into narrow spaces.

Length:

11 mm - Small footprint for compact system designs.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications where reliability is crucial.

Terminal Form:

BALL - Provides secure connections with good contact.

Maximum Supply Current:

800 mA - Can handle high current loads without overheating.

Nominal Supply Voltage:

1.2 V - Standard voltage level for compatibility with other components.

Terminal Pitch:

1 mm - Close terminal spacing for efficient PCB layout.

Interface IC Type:

INTERFACE CIRCUIT - Versatile IC for various interface applications.

Technical Specifications

Other Function Interface ICs PI2EQX5904NJEX attributes and parameters. Explore more Other Function Interface ICs devices from Diodes Incorporated

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B100

Length:

11 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

1.2

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

800 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

11 mm

Trade Compliance

PI2EQX5904NJEX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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