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DMT5015LFDF-7

Diodes Incorporated

DMT5015LFDF-7 by Diodes Incorporated

DMT5015LFDF-7 by Diodes Inc. is a N-CHANNEL FET with 50V DS Breakdown Voltage, ideal for SWITCHING applications. It features 60A IDM, 10.4mJ EAS, and 0.015 ohm RDS(ON). With a small outline package style and -55 to 150 °C operating temperature range, it offers high performance in power management systems.

Median Price

$0.178

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,331 parts In-Stock

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$0.183

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Arrow

USA . 9,331 parts In-Stock

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$0.172

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$0.161

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$0.161

Avnet

USA . 3,000 parts In-Stock

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$0.173

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$0.173

RS (Exports)

UK . 1,580 parts In-Stock

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$0.367

1,580

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$0.367

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ComSIT Distribution GmbH

Germany . 36,000 parts In-Stock

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Semtec, LLC

USA . 12,450 parts In-Stock

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Extreme Components

USA . 2,269 parts In-Stock

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Bristol Electronics

USA . 2,123 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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SPM Sales

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Semicontronic

India . 6,621 parts In-Stock

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$0.146

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$0.142

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$0.142

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Corohmni

South Africa . 13 parts In-Stock

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$0.263

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AZTECH Wire

Italy . 1,008 parts In-Stock

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$19.210

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Kepictronics

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Lixinc

USA . 6,278 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Aranea Global

USA . 500 parts In-Stock

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Overview

Enhance your electronic applications with the DMT5015LFDF-7 from Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a wide range of features including a built-in diode and high operating temperatures, this N-CHANNEL transistor offers superior performance and reliability. Upgrade your projects with the DMT5015LFDF-7 and experience the value and benefits it brings to your designs. Trust Diodes Incorporated to provide you with the best components for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for more efficient switching operations and provides reverse voltage protection.

Minimum DS Breakdown Voltage: 50 V

Can handle high voltage applications, making it versatile for a range of power supply needs.

Maximum Pulsed Drain Current (IDM): 60 A

Capable of handling high current loads during peak operations, making it suitable for power switching applications.

Maximum Power Dissipation (Abs): 1.97 W

Efficiently dissipates heat generated during operation, ensuring stable performance under high power conditions.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, ideal for industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.015 ohm

Low on-resistance minimizes power loss and heat generation, enhancing the efficiency of the transistor.

Technical Specifications

Power Field Effect Transistors (FET) DMT5015LFDF-7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

10.4 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (ID):

9.1 A

Maximum Drain-Source On Resistance:

.015 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

15.2 pF

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMT5015LFDF-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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