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DMT10H072LFDFQ-7

Diodes Incorporated

DMT10H072LFDFQ-7 by Diodes Incorporated

DMT10H072LFDFQ-7 by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 22A max pulsed drain current, ideal for switching applications. It operates in enhancement mode, has a 0.062 ohm max drain-source resistance, and meets AEC-Q101 standards.

Median Price

$0.181

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 144,000 parts In-Stock

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$0.181

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$0.181

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Vyrian

USA . 60,412 parts In-Stock

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60,412

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NAC Semi

USA . 12,000 parts In-Stock

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$0.270

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$0.270

Nova Conductors

Japan . 900 parts In-Stock

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900

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Ampacity Inc.

Singapore . 60,144 parts In-Stock

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$0.154

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$0.154

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Corohmni

South Africa . 703 parts In-Stock

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$1.064

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703

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Aztec Data Supply Inc.

USA . 4,095 parts In-Stock

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$1.100

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$1.100

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Continental Prestige Electronics

USA . 5,670 parts In-Stock

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Lixinc

USA . 4,808 parts In-Stock

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Argo Parts USA

USA . 4,004 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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$0.300

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iodParts Technologies Inc.

India . 2,985 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Experience superior performance with the DMT10H072LFDFQ-7 by Diodes Incorporated. This power FET offers reliable switching capabilities, making it ideal for a variety of applications. With a maximum pulsed drain current of 22A and an avalanche energy rating of 1.8mJ, this N-channel transistor is designed for enhanced efficiency. The small outline package body material ensures easy installation, while the nickel palladium gold terminal finish guarantees long-lasting durability. Trust Diodes Incorporated for quality components that deliver exceptional value and benefits to customers looking for top-notch performance in their electronic devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and ensures reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower conduction losses and better efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast switching speeds and low power dissipation.

Minimum DS Breakdown Voltage: 100 V

Suitable for high voltage applications and provides a safety margin for voltage spikes.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.062 ohm

Low on-resistance leads to reduced power losses and higher efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) DMT10H072LFDFQ-7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

1.8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.062 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

2.5 pF

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Reference Standard:

AEC-Q101; IATF 16949; MIL-STD-202

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMT10H072LFDFQ-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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