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DMN3008SFGQ-13

Diodes Incorporated

DMN3008SFGQ-13 by Diodes Incorporated

DMN3008SFGQ-13 by Diodes Incorporated is a N-channel Power FET with 30V DS Breakdown Voltage, ideal for switching applications. It features 80A IDM, 101mJ EAS, and 0.0055 ohm RDS(on). Operating in enhancement mode, it has a max temp of 150°C and -55°C min temp. AEC-Q101 compliant for automotive use.

Median Price

$0.295

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Verical

USA . 3,000 parts In-Stock

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Vyrian

USA . 8,640 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Semicontronic

India . 2,911 parts In-Stock

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$0.245

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$0.243

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Ampacity Inc.

Singapore . 2,694 parts In-Stock

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AZTECH Wire

Italy . 497 parts In-Stock

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Continental Prestige Electronics

USA . 2,905 parts In-Stock

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Argo Parts USA

USA . 2,703 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Looking for a reliable Power Field Effect Transistor for your switching applications? Look no further than the DMN3008SFGQ-13 by Diodes Incorporated. With a durable plastic/epoxy body and N-channel configuration, this transistor offers enhanced performance and efficiency. Perfect for a wide range of applications, this transistor boasts a maximum pulsing drain current of 80A and a minimum DS breakdown voltage of 30V. Trust Diodes Incorporated to provide you with top-quality components that deliver exceptional value and reliability. Choose the DMN3008SFGQ-13 for all your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the FET lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics and lower on-resistance compared to P-channel FETs, making them a good choice for many applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides efficient and reliable performance in switching circuits.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 80 A

The high maximum pulsed drain current rating of 80A ensures that this FET can handle large current spikes, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 2.1 W

With a maximum power dissipation of 2.1W, this FET can dissipate heat efficiently, ensuring reliable performance in high-power applications.

Maximum Drain-Source On Resistance: 0.0055 ohm

The low on-resistance of 0.0055 ohm ensures minimal power loss and efficient switching operation in the FET.

Technical Specifications

Power Field Effect Transistors (FET) DMN3008SFGQ-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

101 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

17.6 A

Maximum Drain-Source On Resistance:

.0055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

459 pF

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN3008SFGQ-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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