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AP9101CAK6-CPTRG1

Diodes Incorporated

AP9101CAK6-CPTRG1 by Diodes Incorporated

Diodes Inc.'s AP9101CAK6-CPTRG1 is a Power Management IC with 3.5V Vsup, -40 to 85°C operating temp, and 6 terminals in a small outline package. Ideal for industrial applications requiring power supply support circuits with a supply voltage range of 1.5V to 5.5V and surface mount capability.

Median Price

$0.109

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 77 parts In-Stock

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$0.109

77

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$0.109

Distributors (In-Stock)

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Nova Conductors

Japan . 99 parts In-Stock

1+ parts

$0.140

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99

$0.140

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Chip Stock

USA . 24,500 parts In-Stock

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24,500

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Vyrian

USA . 3,037 parts In-Stock

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3,037

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VNN

France . 845 parts In-Stock

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845

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Distributors (Availability)

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Ampacity Inc.

Singapore . 289 parts In-Stock

1+ parts

$0.093

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289

$0.093

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Netroflash

USA . 1,000 parts In-Stock

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$0.140

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$0.137

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1,000

$0.140

$0.137

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Continental Prestige Electronics

USA . 2,969 parts In-Stock

1+ parts

$0.408

100+ parts

$0.176

1k+ parts

$0.110

10k+ parts

$0.098

2,969

$0.408

$0.176

$0.110

$0.098

AZTECH Wire

Italy . 702 parts In-Stock

1+ parts

$5.244

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702

$5.244

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Microchip USA

USA . 483 parts In-Stock

1+ parts

$15.010

100+ parts

$14.900

1k+ parts

$14.900

10k+ parts

$14.790

483

$15.010

$14.900

$14.900

$14.790

QUARKTWIN TECHNOLOGY LTD

USA . 21,466 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Overview

Enhance your power management capabilities with the AP9101CAK6-CPTRG1 by Diodes Incorporated. Known for their high-quality components, Diodes Incorporated delivers top-notch solutions for various applications in the Power Management ICs category. This small outline, thin profile IC offers customers a reliable and efficient way to manage power supply support circuits with a wide operating temperature range and dual terminal position. Experience the value and benefits of this product, designed to meet industrial-grade standards and provide seamless integration into your systems. Choose Diodes Incorporated for superior performance and innovation in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good insulation, making the product durable and reliable.

Surface Mount: YES

Makes it easier to mount on printed circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 3.5 V

Optimal voltage for power management, ensuring efficient operation and reliability.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat may be a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, increasing the efficiency of the power management IC.

Technical Specifications

Power Management ICs AP9101CAK6-CPTRG1 attributes and parameters. Explore more Power Management ICs devices from Diodes Incorporated

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

AP9101CAK6-CPTRG1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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