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AP9101CAK-CPTRG1

Diodes Incorporated

AP9101CAK-CPTRG1 by Diodes Incorporated

Diodes Inc.'s AP9101CAK-CPTRG1 is a Power Management IC with 5 terminals, operating from -40 to 85°C. It supports supply voltages from 1.5V to 5.5V and features a small outline package suitable for industrial applications. The CMOS technology and dual terminal position make it ideal for power supply support circuits in compact designs.

Median Price

$0.223

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 95 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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95

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Element14

Singapore . 95 parts In-Stock

1+ parts

-

100+ parts

$0.223

1k+ parts

$0.139

10k+ parts

-

95

-

$0.223

$0.139

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,654 parts In-Stock

1+ parts

-

100+ parts

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2,654

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 6,746 parts In-Stock

1+ parts

$0.480

100+ parts

$0.210

1k+ parts

$0.140

10k+ parts

-

6,746

$0.480

$0.210

$0.140

-

Continental Prestige Electronics

USA . 2,995 parts In-Stock

1+ parts

$0.483

100+ parts

$0.209

1k+ parts

$0.129

10k+ parts

$0.102

2,995

$0.483

$0.209

$0.129

$0.102

Microchip USA

USA . 2,331 parts In-Stock

1+ parts

$0.899

100+ parts

-

1k+ parts

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2,331

$0.899

-

-

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AZTECH Wire

Italy . 261 parts In-Stock

1+ parts

$21.350

100+ parts

-

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-

10k+ parts

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261

$21.350

-

-

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Infinite Electronics LLP (Excess)

. 6,017 parts In-Stock

1+ parts

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6,017

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Formix International (Excess)

India . 5,990 parts In-Stock

1+ parts

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5,990

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Northwest PG Solutions

USA . 646 parts In-Stock

1+ parts

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646

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Native Components

USA . 539 parts In-Stock

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539

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Overview

Discover the superior quality and reliability of the AP9101CAK-CPTRG1 by Diodes Incorporated, a leading manufacturer in the Power Management ICs category. This innovative product offers unmatched value and benefits to customers seeking efficient power supply support circuit solutions in industrial applications. With its small outline, low profile package design and wide operating temperature range, this Power Management IC is the ideal choice for your next project. Trust Diodes Incorporated to deliver top-notch performance and durability in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and thermal stability to the package, ensuring reliability in various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3.5 V

The nominal supply voltage of 3.5V indicates compatibility with a wide range of applications while providing sufficient power for the power management IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this power management IC can withstand elevated temperatures without compromising performance, making it suitable for industrial environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and wide operating voltage range, making the power management IC efficient and reliable.

Technical Specifications

Power Management ICs AP9101CAK-CPTRG1 attributes and parameters. Explore more Power Management ICs devices from Diodes Incorporated

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

AP9101CAK-CPTRG1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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