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AP3983BMTR-G1

Diodes Incorporated

AP3983BMTR-G1 by Diodes Incorporated

STANDARD SRAM; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

$0.311

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$0.311

100+ parts

-

1k+ parts

-

10k+ parts

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63

$0.311

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-

Chip Stock

USA . 75,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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75,400

-

-

-

-

VNN

France . 3,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,187

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-

-

-

Vyrian

USA . 2,816 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,816

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.311

100+ parts

-

1k+ parts

$0.295

10k+ parts

$0.289

2,000

$0.311

-

$0.295

$0.289

Argo Parts USA

USA . 1,771 parts In-Stock

1+ parts

$0.311

100+ parts

-

1k+ parts

-

10k+ parts

$0.302

1,771

$0.311

-

-

$0.302

Continental Prestige Electronics

USA . 4,000 parts In-Stock

1+ parts

$0.735

100+ parts

$0.398

1k+ parts

$0.246

10k+ parts

-

4,000

$0.735

$0.398

$0.246

-

Aztec Data Supply Inc.

USA . 1,587 parts In-Stock

1+ parts

$2.630

100+ parts

-

1k+ parts

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10k+ parts

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1,587

$2.630

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-

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$2.658

100+ parts

-

1k+ parts

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10k+ parts

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71

$2.658

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AZTECH Wire

Italy . 688 parts In-Stock

1+ parts

$19.840

100+ parts

-

1k+ parts

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10k+ parts

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688

$19.840

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-

Ampacity Inc.

Singapore . 442 parts In-Stock

1+ parts

$24.000

100+ parts

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1k+ parts

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10k+ parts

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442

$24.000

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-

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Metaverse IC Inc.

Canada . 70,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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70,000

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-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 14,530 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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14,530

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-

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Lixinc

USA . 3,315 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,315

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Microchip USA

USA . 345 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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345

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Technical Specifications

SRAM AP3983BMTR-G1 attributes and parameters. Explore more SRAM devices from Diodes Incorporated

Specs

JESD-609 Code:

e3

Memory IC Type:

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

AP3983BMTR-G1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

Category top products 20

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