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MB96F356RSBPMC1-GSE2

Cypress Semiconductor

MB96F356RSBPMC1-GSE2 by Cypress Semiconductor

MB96F356RSBPMC1-GSE2 by Cypress Semiconductor is a 16-bit microcontroller with 64 terminals, operating at -40 to 125°C. Featuring 147456 ROM words and 12288 RAM bytes, it's ideal for automotive applications requiring a high-speed CPU like F2MC-16F. With FLASH ROM programmability and low power consumption of 62mA at max, it offers efficient performance in compact designs.

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Overview

Unlock the potential of your automotive applications with the MB96F356RSBPMC1-GSE2 microcontroller by Cypress Semiconductor. This high-quality product boasts a 16-bit architecture and comes in a convenient square-shaped package for easy surface mounting. With a wide operating temperature range and low power consumption, this microcontroller is perfect for automotive systems that require reliable performance in harsh environments. Trust Cypress Semiconductor for cutting-edge technology that delivers value and efficiency to your projects. Elevate your designs with the MB96F356RSBPMC1-GSE2 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps protect the internal components of the microcontroller.

Surface Mount: YES

Surface mount capability makes it easier to integrate the microcontroller onto circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, making it ideal for compact designs.

Bit Size: 16

16-bit architecture provides sufficient processing power for a wide range of applications, offering a good balance between performance and cost.

Power Supplies (V): 3.3/5

Multiple voltage options allow for flexibility in power supply design, making it adaptable to various operating conditions.

No. of Terminals: 64

64 terminals provide ample connectivity options for interfacing with external devices and peripherals, enhancing versatility.

Package Style (Meter): FLATPACK

Flatpack package style offers easy installation and maintenance, ensuring reliable performance in automotive and industrial environments.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes it suitable for demanding applications where temperature variations are common.

CPU Family: F2MC-16F

F2MC-16F CPU family offers optimized performance and features for embedded systems, providing efficient processing capabilities.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables reliable operation in extreme cold environments, making it suitable for outdoor and industrial applications.

Terminal Position: QUAD

Quad terminal position allows for easy connection to external components, simplifying the integration process and improving reliability.

ROM Words: 147456

Large ROM capacity allows for storing extensive program code, data, and firmware, enabling the microcontroller to support complex functions and applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable performance in automotive applications, meeting industry standards for quality and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient data processing and control capabilities, enhancing performance and responsiveness.

RAM Bytes: 12288

Ample RAM capacity allows for efficient data storage and manipulation, facilitating high-speed operation and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides a secure and robust connection to the circuit board, ensuring stable operation and ease of assembly.

Maximum Supply Current: 62 mA

Low maximum supply current consumption makes the microcontroller energy-efficient and suitable for battery-powered applications, extending the product's operational life.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and modifications, enabling quick and cost-effective enhancements to the microcontroller's features and capabilities.

Terminal Pitch: 0.5 mm

Small terminal pitch provides high-density packaging and efficient use of space on the circuit board, enabling compact designs and reducing overall product size.

Speed: 56 rpm

High processing speed of 56 rpm enables fast execution of instructions and data processing, improving overall performance and responsiveness of the microcontroller.

Technical Specifications

Microcontrollers MB96F356RSBPMC1-GSE2 attributes and parameters. Explore more Microcontrollers devices from Cypress Semiconductor

Specs

Bit Size:

16

CPU Family:

F2MC-16F

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

147456

ROM Programmability:

FLASH

Speed:

56 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

62 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

MB96F356RSBPMC1-GSE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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