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MB96F338RSAPMC-GSE2

Infineon Technologies

MB96F338RSAPMC-GSE2 by Infineon Technologies

MB96F338RSAPMC-GSE2 by Infineon Technologies is a 16-bit microcontroller with 24-bit address bus width, operating at up to 56 MHz. Ideal for automotive applications, it features 32768 bytes of RAM, flash ROM programmability, and offers PWM and ADC channels for versatile control capabilities.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Nova Conductors

Japan . 700 parts In-Stock

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Vyrian

USA . 639 parts In-Stock

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Digiode

USA . 208 parts In-Stock

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AZTECH Wire

Italy . 673 parts In-Stock

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$5.924

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673

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Corohmni

South Africa . 300 parts In-Stock

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$20.133

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300

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Aztec Data Supply Inc.

USA . 1,634 parts In-Stock

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$43.108

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Modulus Dynamics

Lithuania . 125 parts In-Stock

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$52.097

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$50.013

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$47.929

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125

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$47.929

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Continental Prestige Electronics

USA . 4,074 parts In-Stock

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Argo Parts USA

USA . 2,468 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 783 parts In-Stock

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Overview

Unlock the potential of your projects with the MB96F338RSAPMC-GSE2 microcontroller by Infineon Technologies. Designed with precision and reliability in mind, this powerful device offers endless possibilities for a wide range of applications. From automotive to industrial systems, this microcontroller delivers unparalleled performance and efficiency. Experience the seamless integration of cutting-edge technology and innovative design, providing you with the competitive edge you need to succeed. Trust in Infineon Technologies to bring you quality products that exceed expectations. Elevate your projects to new heights with the MB96F338RSAPMC-GSE2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto PCBs, saving space and making assembly simpler.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs without risk of damage, providing flexibility in power supply options.

Address Bus Width: 24

Wide address bus allows for access to larger memory addresses, increasing the capacity and capabilities of the microcontroller.

Bit Size: 16

16-bit architecture provides a good balance between processing power and efficiency for a wide range of applications.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows for compatibility with different systems and components.

No. of Terminals: 144

With a high number of terminals, this microcontroller can support a wide range of input and output connections for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and low-profile package style saves space and allows for dense PCB designs, suitable for applications with size constraints.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability and performance in harsh environmental conditions.

CPU Family: F2MC-16F

Part of a well-established CPU family known for its efficient and reliable performance in embedded systems.

ROM Words: 557056

Large ROM capacity allows for storing complex programs and data, enabling advanced functionality and applications.

Maximum Clock Frequency: 56 MHz

High clock frequency enables fast processing speeds, making the microcontroller suitable for real-time applications.

RAM Bytes: 32768

Sufficient RAM capacity for data storage and processing, supporting multitasking and complex algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, extending battery life and overall reliability.

PWM Channels: YES

Support for PWM channels allows precise control over analog outputs, essential for applications requiring accurate voltage or signal modulation.

Technical Specifications

Microcontrollers MB96F338RSAPMC-GSE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

F2MC-16F

Maximum Clock Frequency:

56 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e6

Length:

20 mm

No. of I/O Lines:

124

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

557056

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

56 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

71 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MB96F338RSAPMC-GSE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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