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FM16W08-PG

Cypress Semiconductor

FM16W08-PG by Cypress Semiconductor

FRAM; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 8KX8; Endurance: 100000000000000 Write/Erase Cycles;

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QUARKTWIN TECHNOLOGY LTD

USA . 3,787 parts In-Stock

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Microchip USA

USA . 177 parts In-Stock

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Technical Specifications

FRAMs FM16W08-PG attributes and parameters. Explore more FRAMs devices from Cypress Semiconductor

Specs

Maximum Access Time:

80 ns

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T28

Length:

37.4015 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Maximum Seated Height:

6.35 mm

Maximum Standby Current:

.00005 Amp

Minimum Standby Voltage:

2.7 V

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

FM16W08-PG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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