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CY14B108M-ZSP25XI

Cypress Semiconductor

CY14B108M-ZSP25XI by Cypress Semiconductor

NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Median Price

$68.482

Lifecycle Status

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Newark

USA . 25 parts In-Stock

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$56.080

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$51.260

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Chip1Stop

Japan . 18 parts In-Stock

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$74.900

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DigiKey

USA . 194 parts In-Stock

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$84.920

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$73.902

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$71.821

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$84.920

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Mouser Electronics

USA . 159 parts In-Stock

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$85.730

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$72.800

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Rochester

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$49.650

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$44.420

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$41.810

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Verical

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$62.063

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$55.525

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$52.263

280

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$62.063

$55.525

$52.263

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Digiode

USA . 554 parts In-Stock

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$42.883

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Vyrian

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$45.140

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Chip Stock

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Nova Conductors

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Corphita

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$40.626

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Modulus Dynamics

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$51.158

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$49.112

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$47.065

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Microchip USA

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$54.544

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Component Stockers USA

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$98.780

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

USA . 4,596 parts In-Stock

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Authorized Procurement Solutions

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iodParts Technologies Inc.

India . 2,451 parts In-Stock

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Aranea Global

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Technical Specifications

SRAM CY14B108M-ZSP25XI attributes and parameters. Explore more SRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

25 ns

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.415 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

54

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.01 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

75 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

CY14B108M-ZSP25XI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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