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HCPL-810J-000E

Broadcom

HCPL-810J-000E by Broadcom

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

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2

In-Stock Inventory

< 1k

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Vyrian

USA . 452 parts In-Stock

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Digiode

USA . 383 parts In-Stock

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383

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Distributors (Availability)

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Decca Corp

Germany . 1,530 parts In-Stock

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$14.000

100+ parts

$13.720

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$13.583

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1,530

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$13.583

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Supply Digital

USA . 2,738 parts In-Stock

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Northwest PG Solutions

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Corphita

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Native Components

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Kepictronics

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Technical Specifications

Other Function Telecom Interface ICs HCPL-810J-000E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Broadcom

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.312 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

3.632 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.493 mm

Trade Compliance

HCPL-810J-000E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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