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MAXQ1741-FBX+

Analog Devices

MAXQ1741-FBX+ by Analog Devices

Analog Devices' MAXQ1741-FBX+ is a 16-bit microcontroller with 16384 ROM words and 1024 RAM bytes. Operating at up to 12 MHz, it supports AES, TIMER(3), WDT peripherals and interfaces like I2C, SPI(2), USART. Ideal for industrial applications requiring low power consumption and secure data processing.

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MAXQ1741-FBX+ by Analog Devices
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Analog Devices Inc

USA . 6,596 parts In-Stock

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6,596

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Digiode

USA . 2,381 parts In-Stock

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Vyrian

USA . 1,747 parts In-Stock

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Anansix

USA . 627 parts In-Stock

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Semicontronic

India . 5,545 parts In-Stock

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$7.000

100+ parts

$6.825

1k+ parts

$6.790

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5,545

$7.000

$6.825

$6.790

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$33.818

100+ parts

$30.774

1k+ parts

$27.731

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3,000

$33.818

$30.774

$27.731

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MARBEL Systems

Belgium . 100 parts In-Stock

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$67.335

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$64.641

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100

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Texas Native Microelectronics

USA . 3,946 parts In-Stock

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$77.396

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$74.300

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$71.978

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3,946

$77.396

$74.300

$71.978

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Kenton Components

USA . 656 parts In-Stock

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$92.875

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$81.730

656

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$81.730

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,299 parts In-Stock

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2,299

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Qasali Group International

UK . 120 parts In-Stock

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$200.610

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$183.893

120

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$200.610

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$183.893

Overview

Elevate your projects with the MAXQ1741-FBX+ microcontroller from Analog Devices, a trusted manufacturer known for delivering top-quality components. Designed for a wide range of applications, this powerful device offers customers unbeatable value and performance. With its innovative features and cutting-edge technology, the MAXQ1741-FBX+ provides unmatched benefits and advantages, making it the ideal choice for all your project needs. Choose reliability, choose Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making this microcontroller a convenient choice for manufacturers.

Maximum Supply Voltage: 3.6 V

With a relatively high maximum supply voltage, this microcontroller can handle a variety of power input levels, providing versatility in different operating conditions.

Package Shape: SQUARE

The square package shape ensures easy handling and installation on the circuit board, optimizing space utilization and overall layout efficiency.

Bit Size: 16

The 16-bit architecture allows for processing more data in a single clock cycle, enhancing the microcontroller's efficiency in handling complex tasks.

Power Supplies (V): 1.8/3.3

The availability of multiple power supply options (1.8V and 3.3V) offers flexibility in designing circuits and interfaces for different voltage requirements.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with external devices and peripherals, making this microcontroller suitable for applications requiring multiple I/O lines.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design in compact electronic devices.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage requirement allows for operation in low-power scenarios, making this microcontroller energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, ensuring robust performance in industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 °C to 85°C enables reliable operation in extreme temperatures, making this microcontroller suitable for outdoor and automotive applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and enhances solderability, ensuring durable connections and reliable performance in various operating environments.

Terminal Position: QUAD

The quad terminal configuration allows for easy PCB layout and efficient routing of connections, simplifying assembly and reducing production costs.

ROM Words: 16384

With a large ROM capacity of 16384 words, this microcontroller can store complex program instructions and data, enabling the implementation of advanced functionalities in embedded systems.

Maximum Seated Height: 0.8 mm

The low maximum seated height facilitates compact PCB design and minimizes the overall device profile, making this microcontroller suitable for space-constrained applications.

Width: 4 mm

The compact width of 4mm makes this microcontroller suitable for small form-factor devices and applications where space optimization is crucial.

Peripherals: AES, TIMER(3), WDT

The availability of advanced peripherals such as AES encryption, multiple timers, and watchdog timer enhances the microcontroller's capabilities for secure and time-critical tasks.

Maximum Clock Frequency: 12 MHz

The high maximum clock frequency of 12 MHz enables fast data processing and real-time operation, making this microcontroller ideal for applications requiring high-speed performance.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time of 30 seconds at peak temperature ensures proper soldering and reliability during manufacturing, contributing to the overall quality of the end product.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows for lead-free soldering processes, meeting the industry standards for environmentally friendly manufacturing practices.

Length: 4 mm

The compact length of 4mm contributes to the overall small footprint of the microcontroller, making it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable operation in harsh industrial environments, making this microcontroller suitable for demanding applications in industrial automation and control systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with integrated peripherals, this device offers efficient data processing and control capabilities, making it a versatile choice for various embedded applications.

RAM Bytes: 1024

With a generous RAM capacity of 1024 bytes, this microcontroller can efficiently store and access data during program execution, enabling smooth operation of complex algorithms and applications.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption, high noise immunity, and reliable performance in digital logic circuits, making it an energy-efficient and robust solution.

Terminal Form: NO LEAD

The no-lead terminal form facilitates automated assembly processes, improves thermal management, and enhances electrical performance, making this microcontroller suitable for modern SMT manufacturing techniques.

Connectivity: 1-WIRE, I2C, SPI(2), USART

With support for multiple communication interfaces such as 1-Wire, I2C, SPI, and USART, this microcontroller offers versatile connectivity options for interfacing with external devices and peripherals.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy updating of program code, quick prototyping, and firmware upgrades, making this microcontroller adaptable to evolving design requirements.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm enables high-density packaging, precise PCB layout, and efficient signal routing, making this microcontroller suitable for miniaturized electronic devices.

Speed: 6 rpm

The specified speed of 6 rotations per minute indicates the performance capability of this microcontroller in handling time-critical tasks and real-time processing requirements.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits allows for storing and executing program instructions efficiently, enhancing the microcontroller's processing speed and overall performance.

No. of I/O Lines: 16

The availability of 16 I/O lines provides sufficient connectivity for interfacing with external devices, sensors, and actuators, making this microcontroller suitable for versatile embedded applications.

Technical Specifications

Microcontrollers MAXQ1741-FBX+ attributes and parameters. Explore more Microcontrollers devices from Analog Devices

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

16

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

6 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

1-WIRE, I2C, SPI(2), USART

Peripherals:

AES, TIMER(3), WDT

Trade Compliance

MAXQ1741-FBX+ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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