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MAXQ1050-BNS+

Analog Devices

MAXQ1050-BNS+ by Analog Devices

Analog Devices' MAXQ1050-BNS+ is a 32-bit microcontroller with 131072 ROM words and 12288 RAM bytes. Operating at a max frequency of 24 MHz, it has 20 I/O lines and operates at an industrial temperature range. Ideal for applications requiring high-speed processing and extensive memory capabilities in compact designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

MAXQ1050-BNS+ by Analog Devices
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,336 parts In-Stock

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Vyrian

USA . 2,155 parts In-Stock

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Anansix

USA . 674 parts In-Stock

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Semicontronic

India . 829 parts In-Stock

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$5.000

100+ parts

$4.875

1k+ parts

$4.850

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829

$5.000

$4.875

$4.850

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AZTECH Wire

Italy . 287 parts In-Stock

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$8.222

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287

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MARBEL Systems

Belgium . 2,606 parts In-Stock

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$16.810

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Texas Native Microelectronics

USA . 45 parts In-Stock

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$19.322

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$17.969

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$17.003

45

$19.322

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$17.969

$17.003

Ampacity Inc.

Singapore . 831 parts In-Stock

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$21.000

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One Stop Electronics

USA . 2,389 parts In-Stock

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$22.000

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Kenton Components

USA . 962 parts In-Stock

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$23.186

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$20.404

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$23.186

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$20.404

Qasali Group International

UK . 2,051 parts In-Stock

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$52.169

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QUARKTWIN TECHNOLOGY LTD

USA . 17,284 parts In-Stock

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Metaverse IC Inc.

Canada . 15,000 parts In-Stock

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Authorized Procurement Solutions

USA . 7,800 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,762 parts In-Stock

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RC Electronics

USA . 5,593 parts In-Stock

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Kepictronics

USA . 2,460 parts In-Stock

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Corphita

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Microchip USA

USA . 1,629 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Experience the next level of innovation with the MAXQ1050-BNS+ by Analog Devices, a top-tier microcontroller designed to meet your needs with unparalleled performance and reliability. Analog Devices, a renowned manufacturer in the industry, ensures a superior product that exceeds expectations. Ideal for a wide range of applications, this microcontroller offers seamless integration and optimal functionality. Elevate your projects with the MAXQ1050-BNS+, providing exceptional value and benefits that cater to your specific requirements. Choose excellence, choose Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material makes the package durable and resistant to damage, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto a PCB, saving space and reducing assembly time.

Bit Size: 32

32-bit architecture provides high computational capabilities and allows for complex operations and multitasking.

Power Supplies (V): 3.3

Operating at 3.3V makes it compatible with a wide range of electronic components and systems, providing flexibility in design.

No. of Terminals: 40

Having 40 terminals allows for versatile connectivity options and integration with various peripherals and devices.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging offers compact size, low profile, and good thermal performance, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand harsh environmental conditions and extended operation without overheating.

Minimum Operating Temperature: -40 °C

The product's ability to operate at -40 °C ensures reliable performance in cold environments and industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides good solderability and corrosion resistance, ensuring strong electrical connections.

ROM Words: 131072

Large ROM capacity of 131072 words enables storage of extensive program code and data, facilitating complex applications.

Width: 5 mm

Compact width of 5mm enables space-efficient PCB layout and integration in small electronic devices.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency of 24 MHz allows for fast processing speed and reduced execution time for tasks.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperature of 260 °C during assembly processes, ensuring reliable solder joints.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the product can operate in demanding environmental conditions with high reliability.

RAM Bytes: 12288

Generous RAM capacity of 12288 bytes provides ample space for data storage and temporary variables, enhancing performance and functionality.

Terminal Form: NO LEAD

Lead-free terminal form compliant with environmental regulations and offers better reliability and long-term solder joint integrity.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and simplifies system design.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast reprogramming of code, enabling quick prototyping and firmware updates.

Terminal Pitch: 0.4 mm

Narrow terminal pitch of 0.4mm enables high-density packaging and fine-pitch PCB layout, saving space and improving signal integrity.

Speed: 20 rpm

Operating speed of 20 rpm provides efficient processing of instructions and data, enhancing overall system performance.

No. of I/O Lines: 20

Having 20 I/O lines allows for versatile interfacing with external devices, sensors, and peripherals, enhancing the product's connectivity and functionality.

Technical Specifications

Microcontrollers MAXQ1050-BNS+ attributes and parameters. Explore more Microcontrollers devices from Analog Devices

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

20

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

20 rpm

Sub-Category:

Microcontrollers

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAXQ1050-BNS+ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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