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MAX9776ETJ+

Analog Devices

MAX9776ETJ+ by Analog Devices

Analog Devices' MAX9776ETJ+ is a VOLUME CONTROL CIRCUIT with 75 dB Channel Separation, operating at 3.3V. This SQUARE-shaped IC has 32 terminals in CHIP CARRIER package style for audio applications requiring precise volume control and high channel separation.

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MAX9776ETJ+ by Analog Devices
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Vyrian

USA . 8,517 parts In-Stock

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Anansix

USA . 1,557 parts In-Stock

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Digiode

USA . 243 parts In-Stock

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R&J Components

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MARBEL Systems

Belgium . 840 parts In-Stock

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$1.957

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Texas Native Microelectronics

USA . 29,522 parts In-Stock

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$2.249

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$2.159

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$2.092

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$1.979

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Kenton Components

USA . 1,504 parts In-Stock

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$2.375

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Qasali Group International

UK . 85 parts In-Stock

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$6.072

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$5.647

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$5.344

85

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$5.344

Semicontronic

India . 240 parts In-Stock

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$14.800

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$14.430

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$14.356

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Ampacity Inc.

Singapore . 240 parts In-Stock

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$17.800

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Corphita

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Benley Electronics

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Overview

Elevate your audio experience with the MAX9776ETJ+ from Analog Devices, a leading manufacturer in the industry. This Audio Control IC offers unparalleled quality and precision in volume control circuits, providing crystal-clear sound and exceptional channel separation of 75 dB. Perfect for a wide range of applications, this versatile chip carrier with a very thin profile delivers maximum performance even in industrial settings. With a minimum supply voltage of 2.7V and low power consumption of only 18mA, this innovative solution ensures optimal efficiency without compromising on performance. Upgrade your audio systems today with the MAX9776ETJ+ and immerse yourself in a world of superior sound quality and reliability.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy to mount the IC on a PCB, saving space and making it suitable for compact designs.

Channel Separation: 75 dB

High channel separation ensures clear and distinct audio output for each channel, preventing any crosstalk or interference.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, making it compatible with a wide range of electronic devices and power sources.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package with heat sink/slug and thin profile helps in efficient heat dissipation, ensuring reliable performance even in high temperature environments.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures up to 85 °C, making it suitable for industrial applications or harsh operating conditions.

Technology: BICMOS

Utilizes Bipolar-CMOS technology, combining the advantages of both bipolar and CMOS technologies for improved performance, speed, and efficiency.

Technical Specifications

Audio Control ICs MAX9776ETJ+ attributes and parameters. Explore more Audio Control ICs devices from Analog Devices

Specs

Channel Separation:

75 dB

General IC Type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

18 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX9776ETJ+ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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