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MAX4980ETA+

Analog Devices

MAX4980ETA+ by Analog Devices

MAX4980ETA+ by Analog Devices is a Telecom Protection IC with 8 terminals in a small outline package. It operates b/w -40 to 85 °C, featuring surge protection circuit technology. With a rectangular shape and matte tin finish, it's ideal for telecom applications requiring industrial temperature grade.

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6

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1k+

MAX4980ETA+ by Analog Devices
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Analog Devices Inc

USA . 14,031 parts In-Stock

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Anansix

USA . 2,884 parts In-Stock

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Connector Distribution Corp

USA . 2,500 parts In-Stock

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2,500

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Right Parts Inc.

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 1,368 parts In-Stock

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Vyrian

USA . 1,227 parts In-Stock

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MARBEL Systems

Belgium . 2,083 parts In-Stock

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$15.394

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Texas Native Microelectronics

USA . 414 parts In-Stock

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$17.694

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$16.455

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$15.571

414

$17.694

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$15.571

Kenton Components

USA . 768 parts In-Stock

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$21.233

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$18.685

768

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$18.685

Qasali Group International

UK . 5,861 parts In-Stock

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$47.774

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Semicontronic

India . 17,540 parts In-Stock

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$916.000

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$893.100

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$888.520

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$916.000

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Corphita

USA . 1,108 parts In-Stock

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Perfect Parts

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Overview

Enhance the reliability and protection of your telecom systems with the MAX4980ETA+ by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers superior quality and performance in their telecom protection ICs. Safeguard your equipment from power surges and ensure seamless operation with this advanced surge protection circuit. With a small outline, very thin profile package design, this product offers easy integration and space-saving benefits. Trust Analog Devices to provide the solutions you need for a more efficient and secure telecom infrastructure.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to environmental factors, making this product suitable for various telecom applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape enables compact and space-saving design integration, making it ideal for devices with limited space constraints.

No. of Terminals: 8

Having multiple terminals allows for versatile connectivity options and compatibility with different systems and components.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding operating conditions, enhancing the product's durability.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures enables usage in various environments, from extremely cold to hot conditions, providing versatility and flexibility.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Small outline and thin profile design make this product suitable for compact and lightweight applications, increasing overall efficiency and portability.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent conductivity and corrosion resistance, ensuring stable and long-lasting connections for superior performance.

Maximum Seated Height: 0.8 mm

Low seated height allows for close placement of components on PCBs, reducing space constraints and enabling efficient layout design.

Width: 2 mm

Compact width size makes this product suitable for applications requiring minimal board space, enhancing overall system integration.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature ensures minimal thermal stress on the product during assembly, maintaining component integrity and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for robust soldering processes, ensuring secure and durable connections for long-term performance.

Length: 3 mm

Optimal length size provides a balanced form factor for easy handling and installation, improving overall usability and accessibility.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments and industrial settings, making it a suitable choice for robust applications.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS capabilities, providing high-speed operation and low power consumption for efficient performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with RoHS regulations, promoting environmentally friendly manufacturing practices and ensuring product safety.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry safeguards telecom devices from power surges and voltage spikes, ensuring equipment longevity and reliable operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB layout and miniaturization, enabling compact and space-efficient designs for advanced telecom applications.

Technical Specifications

Telecom - Protection ICs MAX4980ETA+ attributes and parameters. Explore more Telecom - Protection ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

MAX4980ETA+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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