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MAX2016ETI+D

Analog Devices

MAX2016ETI+D by Analog Devices

MAX2016ETI+D by Analog Devices is a 28-terminal BICMOS chip with 2 functions, operating at -40 to 85 °C. It has a nominal voltage of 3.3 V and supports power supplies of 3/5 V. This analog computational device, with a bandwidth of 22 kHz, is ideal for industrial applications requiring log or antilog amplification in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,987 parts In-Stock

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Anansix

USA . 2,728 parts In-Stock

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Digiode

USA . 2,065 parts In-Stock

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Semicontronic

India . 947 parts In-Stock

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$6.500

100+ parts

$6.338

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$6.305

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947

$6.500

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One Stop Electronics

USA . 1,580 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 754 parts In-Stock

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$12.631

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MARBEL Systems

Belgium . 4,024 parts In-Stock

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$17.349

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Texas Native Microelectronics

USA . 4,424 parts In-Stock

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$19.941

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$18.545

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$17.548

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Kenton Components

USA . 2,549 parts In-Stock

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$23.929

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$21.058

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Qasali Group International

UK . 3,175 parts In-Stock

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$53.841

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Corphita

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Perfect Parts

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Enhance your analog computational projects with the MAX2016ETI+D by Analog Devices. With a reputation for high-quality manufacturing, Analog Devices brings you a surface mount device that offers 2 functions in one compact package. Perfect for industrial applications, this chip carrier boasts a nominal supply voltage of 3.3V and a wide temperature range from -40 °C to 85°C. Experience the value of precise performance and reliability with the MAX2016ETI+D, making your projects more efficient and effective.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making this product suitable for automated production processes.

No. of Functions: 2

Having multiple functions in one component saves space on the circuit board and simplifies the overall design.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it ideal for applications where board real estate is limited.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a commonly used supply voltage ensures compatibility with standard power sources.

Power Supplies (V): 3/5

Support for multiple power supply voltages allows for flexibility in system integration and compatibility with different power sources.

No. of Terminals: 28

Having a high number of terminals enables connectivity with other components and peripherals, expanding the product's potential applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile ensures efficient heat dissipation and compact form factor, suitable for applications with space constraints and thermal considerations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions and ensure reliable performance under stress.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures expands the product's use cases to include extreme environments and applications with cold conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, ensuring secure connections and long-term reliability.

Terminal Position: QUAD

The quad terminal position facilitates easy integration into circuit layouts and simplifies connection to other components.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a slim profile and compact design, suitable for applications where space is limited.

Width (mm): 5 mm

The narrow width of the product makes it suitable for applications where space-saving is crucial, while maintaining efficient functionality.

Other IC type: LOG OR ANTILOG AMPLIFIER

The inclusion of a log or antilog amplifier function adds versatility to the product, expanding its range of applications and potential uses.

Minimum Supply Voltage (Vsup): 2.7 V

Support for low supply voltages allows for energy efficiency and compatibility with a wide range of power sources.

Length: 5 mm

The compact length of the product contributes to its overall space-saving design, suitable for small form factor applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this product can withstand harsh conditions and operate reliably in demanding settings.

Maximum Supply Current (Isup): 55 mA

With a maximum supply current of 55 mA, this product offers efficient power consumption and compatibility with standard power sources.

Technology: BICMOS

The BICMOS technology used in this product ensures a balance between high performance and low power consumption, ideal for a wide range of applications.

Nominal Bandwidth: 22 kHz

The nominal bandwidth of 22 kHz indicates the product's ability to handle high-frequency signals and data, making it suitable for applications requiring fast processing.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and improves reliability, reducing the risk of soldering defects and ensuring secure connections.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and compact circuit designs, making the product suitable for applications with limited space.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V offers flexibility in power input options and ensures compatibility with a wide range of power sources.

Technical Specifications

Analog Computational MAX2016ETI+D attributes and parameters. Explore more Analog Computational devices from Analog Devices

Specs

Other IC type:

Nominal Bandwidth:

22 kHz

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

55 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

MAX2016ETI+D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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